Light Emitting Device Phosphor Layer Segmentation
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Solution Overview
Problem
Existing light emitting devices with a wavelength conversion layer in the outer peripheral region suffer from inconsistent luminous intensity distribution due to the extension of the phosphor layer, which affects productivity and cost-effectiveness in manufacturing.
Innovation Solution
A method of manufacturing a CSP-type light emitting device that includes forming a separation layer covering the substrate and semiconductor stacked-layer bodies, removing the substrate, and forming a wavelength conversion layer on the semiconductor stacked-layer body side, with the wavelength conversion layer being selectively removed from the outer peripheral region using a separation boundary.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the phosphor layer is extended to the outer peripheral region to cover the semiconductor light emitting element, then the protection and structural integrity are improved, but the luminous intensity distribution becomes inconsistent
Solution Approach 1:
The phosphor layer is segmented into two distinct regions: a first phosphor layer region disposed over the semiconductor light emitting element for protection, and a second phosphor layer region disposed in the outer peripheral region for wavelength conversion. This segmentation allows each region to fulfill its specific function without compromising overall performance.
Solution Approach 2:
Different regions of the phosphor layer are assigned different functions and properties. The first region provides protection and structural support, while the second region performs wavelength conversion. This local differentiation resolves the contradiction by allowing each area to optimize for its specific purpose.
2Manufacturing precision
If the phosphor layer is removed from the outer peripheral region to improve luminous intensity distribution, then the color consistency is improved, but the protection and structural integrity are reduced
Solution Approach 1:
The phosphor layer is divided into functional segments where the first region maintains protection functions and the second region provides wavelength conversion. This ensures that removing phosphor from certain areas does not compromise overall device protection.
Solution Approach 2:
The phosphor layer serves multiple functions simultaneously: protection, structural support, and wavelength conversion. By distributing these functions across different regions, the device maintains reliability even when phosphor is selectively positioned.
3Manufacturing precision
If complex manufacturing methods are used to achieve precise phosphor layer positioning, then the luminous intensity distribution is improved, but the manufacturing cost and complexity increase
Solution Approach 1:
The substrate is designed with an exposed upper surface at the outer peripheral region before phosphor layer formation. This preliminary structural preparation enables straightforward phosphor layer deposition in specific regions without requiring complex post-processing or precise positioning techniques.
Solution Approach 2:
The substrate structure itself provides the positioning guidance for the phosphor layer through its exposed outer peripheral region. This self-positioning mechanism eliminates the need for complex external positioning systems or sophisticated manufacturing control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in a light emitting device with improved luminous intensity distribution characteristics and enhanced productivity by ensuring the wavelength conversion layer is only present where necessary, optimizing both performance and manufacturing efficiency.
Implementation Method 1
a wavelength conversion layer on the semiconductor stacked-layer body side and the separation layer where the substrate is removed, the wavelength conversion layer made of a resin containing a wavelength conversion member
Data Source
AI summary
A method of manufacturing a light emitting device includes providing a wafer having a substrate and a plurality of semiconductor stacked-layer bodies stacked on the substrate, an upper surface of the substrate being exposed at an outer peripheral region of each of the plurality of semiconductor stack bodies in a plan view, forming a separation layer integrally covering the upper surface of the substrate and an upper surface of the semiconductor stacked-layer body, the separation layer including a separation boundary, forming a support member on the separation layer, removing the substrate, forming a wavelength conversion layer on a side of the semiconductor stack body and the separation layer where the substrate is removed, the wavelength conversion layer made of a resin containing a wavelength conversion member, and removing the wavelength conversion layer located in the outer peripheral region by separating the separation layer at the separation boundary.