Light-emitting Device Phosphor Resin Heat Dissipation
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Solution Overview
Problem
The separate arrangement of phosphor particles in light-emitting devices leads to inadequate heat dissipation, resulting in deterioration of the sealing portion and reduced reliability due to insufficient thermal conductivity.
Innovation Solution
Incorporating a conductor layer connected to an external power source, a phosphor layer with heat-conductive particles having thermal conductivity of not less than 100 W/m·K, and a resin layer containing these particles to enhance heat dissipation from the phosphor layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If phosphor particles are arranged separately from the LED chip (separate arrangement), then color unevenness due to visual angle change is prevented, but heat generated by phosphor particles is not sufficiently dissipated
Solution Approach 1:
A resin layer containing heat-conductive particles (diamond, cubic boron nitride, silicon carbide, beryllium oxide, or aluminum nitride with thermal conductivity ≥100 W/m·K) is introduced as an intermediary substance between the phosphor particles and the external environment. This resin layer acts as a thermal mediator that efficiently conducts heat away from the phosphor particles while maintaining their spatial separation arrangement, thus resolving the contradiction between color uniformity and heat dissipation.
Solution Approach 2:
The thermal conductivity parameter of the resin material is significantly enhanced by incorporating high-thermal-conductivity particles (≥100 W/m·K), transforming it from a typical insulating resin into an effective heat dissipation medium. This parameter change enables the resin layer to serve dual functions: maintaining phosphor particle positioning for color uniformity while simultaneously providing efficient thermal conduction pathways.
2Use of energy by moving object
If phosphor particles are arranged in the vicinity of the LED chip (precipitation arrangement), then wavelength conversion efficiency is improved, but heat dissipation from phosphor particles becomes insufficient
Solution Approach 1:
The resin layer with high thermal conductivity particles serves as a thermal intermediary that bridges the gap between the phosphor particles (located near the LED chip for efficient wavelength conversion) and the heat sink. This intermediary structure allows the phosphor particles to remain in close proximity to the LED chip for optimal energy conversion while simultaneously providing an efficient heat conduction pathway to dissipate the generated heat.
3Ease of manufacture
If heat is dissipated only through the lead, then manufacturing is simplified, but heat from phosphor particles in separate arrangement is not sufficiently dissipated
Solution Approach 1:
The resin layer is designed to perform multiple functions simultaneously: it serves as a structural component holding the phosphor particles, as a thermal management solution conducting heat away from the phosphor, and as an optical medium allowing light transmission. This multi-functionality enables improved heat dissipation without adding separate manufacturing steps or components, thus maintaining manufacturing simplicity while solving the heat dissipation problem.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces thermal resistance between the phosphor particles and the conductor layer, effectively improving heat dissipation and preventing deterioration of the light-emitting device components.
Implementation Method 1
a resin layer contacting both of the phosphor layer and the conductor layer and containing heat-conductive particles dispersed therein, wherein the heat-conductive particles have a thermal conductivity of not less than 100 W/m·K
Implementation Method 2
Phosphor particles are excited by light emitted at the time of driving the light-emitting element and emit a desired wavelength-converted light in blue to red color
Data Source
AI summary
A light-emitting device includes a base material having a conductor layer on a surface thereof, the conductor layer being configured to be connected to an external power source, a light-emitting element mounted on the base, a phosphor layer arranged above the light-emitting element, and a resin layer contacting both of the phosphor layer and the conductor layer and containing heat-conductive particles dispersed therein. The heat-conductive particles have a thermal conductivity of not less than 100 W/m·K and an insulator property or a semiconductor property.