LED Device Uniform Phosphor Deposition via Sputtering
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Solution Overview
Problem
Conventional LED device manufacturing methods face challenges in achieving uniform phosphor dispersion and efficient light emission due to the high specific gravity of phosphors relative to the molding resin, making it difficult to produce high-quality multi-wavelength light, such as white light, with uniform spatial distribution of phosphors.
Innovation Solution
A method involving the formation of a mask pattern on the LED chip to deposit a thinly and uniformly distributed phosphor layer using pulsed DC sputtering or pulsed laser deposition, eliminating the need for adhesives and allowing for precise control of phosphor type and amount, thereby enhancing light emission characteristics and reducing manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If phosphors are uniformly dispersed within molding resin, then white light quality is improved, but manufacturing difficulty increases due to phosphor settling caused by specific gravity difference
Solution Approach 1:
The patent extracts phosphors from the molding resin and places them on a phosphor conversion substrate, separating the phosphor dispersion problem from the resin matrix. This eliminates the settling issue caused by specific gravity differences while maintaining uniform light conversion.
Solution Approach 2:
The patent introduces a phosphor conversion substrate as an intermediary between the LED chip and the molding resin. This substrate serves as a dedicated platform for phosphor placement, mediating the light conversion process without requiring phosphors to be dispersed within the resin.
2Manufacturing precision
If phosphors are placed on phosphor conversion substrate, then manufacturing precision is improved through controlled placement, but device complexity increases
Solution Approach 1:
The patent merges the phosphor conversion substrate with the LED chip assembly, integrating the phosphor placement surface into the existing device structure. This reduces overall device complexity while maintaining precise phosphor spatial distribution for optimal light conversion.
3Ease of manufacture
If conventional phosphor dispersion method is used, then manufacturing process is simple, but light emission efficiency deteriorates due to non-uniform phosphor distribution
Solution Approach 1:
The patent extracts phosphors from the resin dispersion process and places them directly on the phosphor conversion substrate using controlled methods. This maintains manufacturing simplicity while achieving uniform phosphor distribution that maximizes light emission efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the production of LED devices that emit multi-wavelength lights, including white, blue-green, or pink light, with improved light emission efficiency and cost-effectiveness by ensuring uniform phosphor distribution and reducing internal reflection through the use of nitrides with similar refractive indices to (Al,In)GaN.
Implementation Method 1
These LED devices generate light of single or multi-wavelengths such as white light or light of multi-wavelengths by phosphor-converting a portion of the light emitted from a blue or ultraviolet LED chip into light of longer wavelengths
Implementation Method 2
deposit a phosphor layer on the LED chip thinly and uniformly using pulsed DC sputtering method
Implementation Method 3
deposit a phosphor layer on the LED chip thinly and uniformly using pulsed DC sputtering method, pulsed RF sputtering method, or pulsed laser deposition (PLD) method
Data Source
AI summary
The present invention relates to a method of manufacturing an LED device which emits light of multi-wavelengths. The invention also relates to a method of manufacturing LED devices which emit light of high quality from throughout the whole surface in a uniform manner. In particular, utilizing the manufacturing method of LED devices which emit light of multi-wavelengths makes it possible to produce LED devices of high quality in a simple and cost-efficient way, not by using adhesives, but by a sputtering or PLD method. In addition, since the characteristics of the desired emitted light can be controlled by controlling the amount and type of the phosphors during the manufacture of sputtering targets, high quality LED devices can be manufactured easily.