LED Package on Phosphor Substrate for Luminance Control
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Solution Overview
Problem
Conventional LED packages face challenges in minimizing size and thickness while maintaining minimal color coordinate deviation due to the limited space required for filling molding material, including phosphor, which affects luminance distribution.
Innovation Solution
An LED package design where the LED chip is directly mounted on a phosphor substrate, with a circuit board and sealing member covering the chip and substrate, allowing for reduced thickness and size while maintaining consistent phosphor distribution, using a glass substrate with embedded or coated phosphor and a ceramic circuit board with electrodes connected by wire, sealed with transparent epoxy or silicon containing reflective materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If molding material including phosphor is filled in the package to maintain color coordinate consistency, then luminance distribution is improved, but package thickness increases
Solution Approach 1:
The patent transitions from filling phosphor-containing molding material in three-dimensional space to depositing phosphor in a two-dimensional layer on the substrate surface. This dimensional change eliminates the need for vertical filling space while maintaining phosphor distribution for luminance control, thereby reducing package thickness while preserving illumination quality
Solution Approach 2:
The patent extracts the phosphor from the molding material matrix and places it directly on the substrate as a separate phosphor layer. This separation allows the phosphor to be positioned precisely where needed for optimal luminance distribution without requiring the additional thickness that would be needed to embed equivalent amounts of phosphor within voluminous molding material
2Manufacturing precision
If voluminous space for molding material is maintained to minimize color coordinate deviation, then color consistency is improved, but package size increases
Solution Approach 1:
The patent applies phosphor locally in a controlled layer directly on the substrate at the LED chip location, rather than distributing phosphor uniformly throughout a voluminous molding material. This localized phosphor placement ensures consistent color coordinates where needed while eliminating the need for excessive package area to accommodate voluminous molding material
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design minimizes color coordinate deviation and reduces package size and thickness, enhancing luminance distribution and manufacturing yield by optimizing phosphor placement and usage, and allowing for thinner LCD panels and smaller form factors.
Implementation Method 1
an LED chip mounted on the phosphor substrate
Implementation Method 2
a sealing member that covers the LED chip, the circuit board, and the phosphor substrate
Data Source
AI summary
Provided is a light emitting diode (LED) package including a phosphor substrate; an LED chip mounted on the phosphor substrate; a circuit board mounted on the other region of the phosphor substrate excluding the region where the LED chip is mounted; an electrode connection portion for electrically connecting the LED chip and the circuit board; and a sealing member that covers the LED chip, the circuit board, and the phosphor substrate.