Wire Mesh Heat Dissipation for LED Phosphor Layers
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Solution Overview
Problem
High-power LEDs with a phosphor layer face overheating issues due to inefficient heat dissipation, leading to premature degradation and reduced performance, and existing solutions that increase device size and cost do not effectively address this problem.
Innovation Solution
A light emitting device with a phosphor layer thermally coupled to a wire mesh, which enhances heat dissipation by transferring heat to a heat sink and vents it outside, while also serving as a physical support to maintain the phosphor layer's integrity and efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the phosphor layer is mounted further away from the light emitting semiconductor to prevent overheating, then the heat dissipation is improved, but the device size increases and manufacturing cost increases
Solution Approach 1:
A wire mesh heat dissipation structure is introduced as an intermediary between the phosphor layer and the external environment. The mesh provides a thermal conduction pathway that efficiently transfers heat from the phosphor layer to the surroundings, enabling effective heat dissipation without increasing the distance between the phosphor layer and semiconductor or enlarging the overall device volume.
Solution Approach 2:
The wire mesh structure inherently creates a porous or open framework that allows heat to dissipate through multiple pathways. This porous configuration increases the effective surface area for heat transfer while maintaining a compact form factor, resolving the contradiction between heat dissipation efficiency and device size.
2Temperature
If the phosphor layer is mounted further away from the light emitting semiconductor to prevent overheating, then the heat dissipation is improved, but the manufacturing cost increases
Solution Approach 1:
The wire mesh serves as a cost-effective intermediary structure that can be easily integrated into the LED manufacturing process. Rather than requiring complex cooling systems or increased component spacing, the mesh provides an economical solution for heat management that maintains manufacturing simplicity and cost-effectiveness.
Solution Approach 2:
The invention changes the thermal conduction parameter of the phosphor layer assembly by introducing the wire mesh with higher thermal conductivity. This parameter change enables efficient heat dissipation using conventional manufacturing techniques and materials, avoiding the need for expensive specialized components or processes.
3Temperature
If a wire mesh is used to dissipate heat from the phosphor layer, then the heat dissipation efficiency is improved, but the device complexity increases
Solution Approach 1:
The wire mesh structure performs multiple functions simultaneously: it serves as a heat dissipation pathway, provides structural support for the phosphor layer, and maintains the mechanical integrity of the assembly. This multi-functionality reduces the need for additional separate components, thereby limiting the increase in device complexity while achieving improved heat dissipation.
Solution Approach 2:
The invention merges the heat dissipation function with the existing phosphor layer structure by integrating the wire mesh directly into the assembly. This consolidation approach combines thermal management with structural support in a single integrated component, avoiding the need for separate complex cooling systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively cools the phosphor layer, preventing degradation and maintaining the device's performance and lifespan, while reducing the device's size and manufacturing costs, and optimizing the balance between heat dissipation and luminance.
Implementation Method 1
a wire mesh thermally coupled to the phosphor layer and configured to dissipate heat from the phosphor layer
Data Source
AI summary
A light emitting device and method of producing the same is disclosed. The light emitting device includes a phosphor layer and a wire mesh thermally coupled to the phosphor layer and configured to dissipate heat from the phosphor layer.