Thermo-Conductive Pillar for LED Thermal Dissipation
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Solution Overview
Problem
Existing LED devices face inefficiencies due to inadequate thermal dissipation, particularly when operating in high ambient temperatures, as the dielectric layer separates the metal plate from the metal substrate, hindering effective temperature exchange.
Innovation Solution
A circuit board LED support system with a high thermal conductivity pillar is introduced, allowing direct contact between the pillar, the circuit board substrate, and the LED package, enhancing thermal dissipation through the use of pre-shaped substrates, metal mesa structures, or columns inserted into the substrate, and filling pockets with thermally conductive materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a dielectric layer is used to support the LED package, then electrical insulation is provided, but thermal dissipation is hindered due to the separation between metal plate and metal substrate
Solution Approach 1:
The dielectric layer is segmented to create a through-hole that allows direct thermal contact between the metal substrate and the LED package's heat dissipation structure, while maintaining electrical insulation in other areas. This segmentation resolves the contradiction by separating the electrical insulation function from the thermal conduction path.
Solution Approach 2:
A metal post or pillar is introduced as an intermediary element that penetrates through the dielectric layer. This intermediary provides a direct thermal conduction path from the LED package to the metal substrate while the dielectric layer maintains electrical insulation. The intermediary resolves the contradiction by creating a dedicated thermal pathway that bypasses the insulating dielectric material.
2Temperature
If direct contact between LED package and metal substrate is established, then thermal dissipation is improved, but electrical insulation is compromised
Solution Approach 1:
The contact area is segmented into a localized region where direct thermal contact occurs through a metal post, while the surrounding dielectric layer maintains electrical insulation. This segmentation allows thermal dissipation improvement without compromising overall electrical insulation integrity.
Solution Approach 2:
The dielectric layer's properties are modified locally at the contact point by creating a through-hole or opening, allowing metal-to-metal thermal contact in that specific location while maintaining insulating properties in all other areas. This local quality change resolves the contradiction by applying different functional properties to different spatial regions.
3Temperature
If a metal plate is attached to the bottom of the LED package, then thermal dissipation is enhanced, but the dielectric layer interferes with temperature exchange
Solution Approach 1:
A portion of the dielectric layer is extracted or removed to create a through-hole that allows direct contact between the metal plate and metal substrate. This extraction eliminates the thermal interference caused by the dielectric layer at the critical contact interface while maintaining its insulating function elsewhere.
Solution Approach 2:
The thermal conduction path is extended into the vertical dimension by introducing a metal post that penetrates through the dielectric layer thickness. This dimensional approach creates a three-dimensional thermal pathway that bypasses the dielectric interference, allowing improved thermal contact without increasing horizontal device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves temperature control efficiency and reduces the risk of overheating and malfunction in LED devices by ensuring direct thermal contact and enhanced heat dissipation.
Implementation Method 1
the pillar is a metal mesa-shaped structure formed on the top surface of the substrate... This pillar improves temperature control efficiency of the LED device
Data Source
AI summary
An LED device with improved circuit board LED support structure is presented. A top surface of a thermally-conductive substrate of this LED device comprises a thermally-conductive pillar. The pillar is not covered with a dielectric layer and an LED package is arranged directly on the pillar with the LED packages bottom thermally-conductive plate in direct contact with the pillar top surface.