Surface Mount LED Package with Enlarged Pin Pads for Thermal Management
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Solution Overview
Problem
Existing surface mount devices (SMDs) for LED displays face challenges in maintaining low operating temperatures, reducing size, and increasing viewing angles while dealing with heat dissipation and glare issues, which are competitive design objectives and often result in decreased color fidelity and effective thermal management.
Innovation Solution
A surface mount LED package design featuring a lead frame with electrically conductive chip carriers and a plastic casing that enhances heat dissipation through increased surface area and reduced profile height, along with asymmetrical contours for improved thermal conductivity and reduced glare, allowing for efficient LED operation and color fidelity across various viewing angles.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional heat dissipation through leads is used, then device structure is simple, but heat dissipation effectiveness is insufficient
Solution Approach 1:
The patent transitions from one-dimensional heat dissipation through leads to two-dimensional heat dissipation through enlarged pin pads with increased surface area. The pin pads are extended laterally to provide greater thermal contact area with the substrate, enabling more effective heat conduction in the planar direction while maintaining a simple package structure.
Solution Approach 2:
The pin pads serve dual functions: electrical connection and thermal management. By enlarging the pin pad surface area, the same structural element performs both electrical signal transmission and heat dissipation, eliminating the need for separate thermal management components and maintaining structural simplicity.
2Volume of moving object
If SMD size is reduced for smaller pixel pitch, then display resolution is improved, but heat dissipation capability is reduced
Solution Approach 1:
The patent applies local quality enhancement by concentrating thermal management resources at the critical heat generation points (LED chips and pin pads). The pin pads are selectively enlarged at the substrate interface to provide localized high-surface-area thermal pathways, while the overall package size remains compact. This targeted approach enables effective heat dissipation from the LED chips without increasing the total package volume.
3Illumination intensity
If material reflective characteristics are increased for brightness, then light output is improved, but color fidelity decreases due to glare
Solution Approach 1:
The patent applies local quality control by selectively positioning reflective surfaces only in regions where they enhance light extraction from the LED chips, while avoiding reflective surfaces on the pin pads and substrate interface where they would create glare and reduce color fidelity. This spatially differentiated approach allows bright light output from the LEDs while maintaining accurate color reproduction by eliminating unwanted reflections from support structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves effective heat dissipation, maintains low operating temperatures, and improves color fidelity and viewing angles, while reducing the size and cost of the SMD package, resulting in enhanced performance and reliability for LED displays.
Implementation Method 1
One conventional way of implementing conduction heat transfer for dissipating heat in an electronic package is to allow the heat to conduct away along the leads of the device
Data Source
AI summary
One embodiment of the surface mount LED package includes a lead frame and a plastic casing at least partially encasing the lead frame. The lead frame includes a plurality of electrically conductive chip carriers. There is an LED disposed on each one of the plurality of electrically conductive chip carriers. A profile height of the surface mount LED package is less than about 1.0 mm.