LED Pitch Expansion via Multi-Stage Laser Transfer
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Solution Overview
Problem
The challenge in manufacturing large-scale LED displays is the inefficient and costly process of transferring millions of LED chips from growth substrates to display backplanes, requiring high accuracy and yield while minimizing material consumption.
Innovation Solution
A method involving multiple carrier substrates with specific pitch adjustments and transfer processes to optimize LED device arrangement, utilizing a laser transfer apparatus to expand pitches and rearrange LED devices for efficient mass production, and forming light conversion and filter layers to enhance LED performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If traditional single-stage transfer method is used to transfer LED chips from growth substrates to display backplanes, then the process is simpler, but the transfer accuracy and yield deteriorate due to the complexity of handling millions of chips
Solution Approach 1:
The patent divides the mass transfer process into multiple sequential stages: first transferring LED chips from growth substrates to intermediate carrier substrates, then from carrier substrates to display backplanes. This segmentation allows each stage to handle smaller batches with controlled pitch adjustments, significantly improving transfer accuracy and yield while maintaining manageable process complexity
Solution Approach 2:
The patent introduces intermediate carrier substrates as mediators in the transfer process. These carrier substrates temporarily hold LED chips and enable pitch expansion from the dense growth substrate arrangement to the display backplane arrangement, facilitating accurate positioning and reducing transfer errors
2Productivity
If pitch expansion is performed to rearrange LED devices on carrier substrates, then substrate utilization is improved, but the manufacturing process becomes more complex
Solution Approach 1:
The patent employs dynamic pitch adjustment during the transfer process. The carrier substrates are designed to accommodate variable pitch configurations, allowing the system to adapt from the small pitch of growth substrates to the larger pitch requirements of display backplanes, thereby improving substrate utilization without requiring completely different manufacturing equipment
Solution Approach 2:
The patent changes the pitch parameter systematically through multiple transfer stages. By gradually expanding the pitch from growth substrate to carrier substrate to display backplane, the process manages complexity while achieving high substrate utilization efficiency
3Reliability
If multiple transfer stages are implemented to improve transfer accuracy, then manufacturing time increases, but the yield improves
Solution Approach 1:
The patent performs preliminary transfer of LED chips to carrier substrates before final assembly on display backplanes. This preliminary action allows for quality control, pitch adjustment, and defect filtering at an intermediate stage, improving overall yield while the modular nature of the process allows for efficient parallel processing to minimize time loss
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables efficient, high-yield, and cost-effective mass production of LED devices by maximizing substrate utilization, reducing material consumption, and improving LED performance through optimized pitch adjustments and layer formation.
Implementation Method 1
The laser module is configured to generate a laser beam
Data Source
AI summary
The application provides a method of manufacturing optoelectronic products. A first carrier substrate is provided with electronic devices arranged as a first matrix with a first row pitch and a first column pitch. A first transferring step is performed to transfer a first portion of the electronic devices from the first carrier substrate to a second carrier substrate to form a second matrix with a second row pitch equal to the first row pitch and a second column pitch larger than the first column pitch. A second transferring step is performed to transfer a second portion of the electronic devices from the second carrier substrate to a third carrier substrate to form a third matrix with a third row pitch larger than the second row pitch and a third column pitch equal to the second column pitch.