LED Pixel Coupling Structure for High-Efficacy Display Mounting

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Solution Overview

Problem

Light emitting diodes (LEDs) with large luminous areas face low current density issues, leading to reduced luminous efficacy, while those with small areas are difficult to mount and replace due to their size, posing challenges in display apparatus manufacturing.

Innovation Solution

A display apparatus design featuring light emitting diode packages with small luminous areas, utilizing a coupling structure to enhance yield and repair, including blue, red, and green LEDs covered by a substrate with insulated electrodes, and a reflective portion to surround the coupling structure, allowing for high current density and improved mounting.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If light emitting diodes with large luminous areas are used, then mounting and replacement become easier, but current density decreases leading to reduced luminous efficacy

Engineering Contradiction:
Improvemounting and replacement easeVSAvoidluminous efficacy
Core Design Contradiction:
Ease of operationVSLoss of energy

Solution Approach 1:

The invention divides the light emitting diode into two distinct parts: a small-area light emitting diode chip responsible for light generation, and a larger substrate that provides mounting functionality. This segmentation allows the chip to maintain small size for high current density while the substrate provides adequate mounting area, resolving the contradiction between ease of operation and energy efficiency.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The invention transitions from a two-dimensional planar arrangement to a three-dimensional vertical structure by stacking the light emitting diode chip on the substrate. This dimensional change enables the small chip to be supported by the larger substrate, allowing both small chip area (for high current density) and large mounting area (for ease of operation) to coexist in different spatial dimensions.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Loss of energy

If light emitting diodes with small luminous areas are used, then luminous efficacy increases through high current density, but mounting and replacement become difficult

Engineering Contradiction:
Improveluminous efficacyVSAvoidmounting and replacement ease
Core Design Contradiction:
Loss of energyVSEase of operation

Solution Approach 1:

The invention segments the light emitting diode system into a small light emitting diode chip and a separate substrate, allowing the chip to maintain small area for high current density while the substrate provides adequate mounting area, thus resolving the contradiction between luminous efficacy and ease of operation.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The substrate acts as an intermediary between the small light emitting diode chip and the mounting structure. It provides electrical connections, mechanical support, and thermal management for the small chip, enabling high current density operation while maintaining ease of mounting and replacement through the larger substrate interface.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Ease of operation

If light emitting diodes with large luminous areas are used, then ease of operation improves, but manufacturing yield decreases due to replacement difficulty

Engineering Contradiction:
Improvemounting easeVSAvoidmanufacturing yield
Core Design Contradiction:
Ease of operationVSProductivity

Solution Approach 1:

By segmenting the light emitting diode into a small chip and separate substrate, the invention enables easier replacement of defective chips while maintaining adequate mounting area on the substrate, thus improving both ease of operation and manufacturing yield simultaneously.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The modular chip-substrate structure allows defective light emitting diode chips to be easily discarded and replaced on the substrate, improving manufacturing yield by enabling efficient repair and rework without requiring replacement of the entire assembly, while the substrate maintains adequate size for handling.

Inventive Principle:
Principle #34Discarding and recovering

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enables high current density and improved yield in manufacturing and replacement of LEDs, enhancing the performance and reliability of display apparatuses by maintaining luminous efficacy despite small luminous areas.

Implementation Method 1

A light emitting diode refers to an inorganic semiconductor device that emits light through recombination of electrons and holes

Methodology Applied
Scientific EffectLight emitting diode: Light Emitting Diode

Implementation Method 2

containing at least one type of phosphor emitting red light through wavelength conversion of light emitted from the blue light emitting diode chip

Methodology Applied
Scientific EffectWavelength conversion: Photoluminescence

Implementation Method 3

a reflective portion to surround the coupling structure

Methodology Applied
Scientific EffectLight reflection: Reflection

Data Source

PatentUS12525584B2Display apparatus and method of manufacturing the same
Publication Date: 2026.01.13 SEOUL SEMICONDUCTOR
  • US12525584B2 patent drawing
  • US12525584B2 patent drawing
  • US12525584B2 patent drawing

AI summary

A display apparatus including a circuit board; and a plurality of pixels formed on the circuit board, wherein at least one of a blue light emitting diode chip, a red light emitting diode part, and a green light emitting diode chip is disposed in each of the pixels, and the blue light emitting diode chip, the red light emitting diode part and the green light emitting diode chip are covered by a coupling structure.