LED Pixel Structure Layout for Compact Full-Color Emission
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Solution Overview
Problem
The current pixel structure of light-emitting diode (LED) displays face challenges in achieving small spacing, large light-emitting area, high process yield, and low cost due to the high aspect ratio and complex bonding and wiring processes of red, green, and blue LEDs.
Innovation Solution
A semiconductor device with a pixel structure that stacks two mini or micro LED chips side by side on a top surface of another chip, forming a single pixel with specific electrode configurations and a passivation layer, reducing volume and simplifying manufacturing processes while increasing the light-emitting area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If red, green, and blue light-emitting diodes are used to form a pixel structure, then the display can achieve full-color emission, but the aspect ratio increases and the bonding and wiring processes become complex
Solution Approach 1:
The patent combines multiple LED chips (red, green, and blue) into a single integrated pixel structure mounted on one substrate. This merging approach allows full-color emission while simplifying the bonding process by reducing the number of separate bonding operations needed compared to traditional multi-chip assemblies.
Solution Approach 2:
The pixel structure is designed to perform multiple functions within a single integrated unit: it provides red, green, and blue light emission simultaneously, incorporates electrical connections, and maintains a compact form factor. This multi-functionality reduces the overall system complexity while achieving full-color display capability.
2Length of moving object
If the thickness and size of light-emitting diodes are reduced, then the display resolution can be improved, but the aspect ratio of the pixel structure increases
Solution Approach 1:
The patent transitions from a vertical stacking approach to a planar integration approach, where multiple LED chips are arranged horizontally on a single substrate. This dimensional change allows reduction of individual LED size while maintaining a balanced pixel aspect ratio through optimized lateral distribution of the LED chips.
Solution Approach 2:
The substrate is designed with non-uniform distribution of LED chips, placing them at specific locations optimized for the display geometry. This local optimization allows smaller LED sizes while maintaining appropriate pixel dimensions and aspect ratios across the display area.
3Area of stationary object
If mini or micro LED chips are stacked side by side on a substrate, then the light-emitting area increases, but the spacing between chips must be controlled for manufacturing precision
Solution Approach 1:
The LED chips are pre-positioned and fixed on the substrate at predetermined locations before final assembly. This preliminary positioning ensures precise spacing between chips, facilitating easier manufacturing while maximizing the light-emitting area through optimized chip arrangement.
Solution Approach 2:
The patent optimizes the spacing parameters between adjacent LED chips to balance manufacturing feasibility with light-emitting area maximization. By carefully controlling the chip pitch and center-to-center distance, the design achieves high luminous output while maintaining tolerable manufacturing precision requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces the pixel structure's volume, simplifies manufacturing, and enhances the light-emitting area, thereby improving process yield and reducing costs.
Implementation Method 1
The light-emitting layer is located on the circuit substrate and emits a first color light with a first wavelength range
Implementation Method 2
The structure is disposed between the light-emitting layer and the circuit substrate and emits a second color light with a second wavelength range
Data Source
AI summary
A semiconductor device includes a circuit substrate, a light-emitting layer, a structure, and a light-emitting diode chip. The light-emitting layer is located on the circuit substrate and emits a first color light with a first wavelength range. The structure is disposed between the light-emitting layer and the circuit substrate. The structure emits a second color light with a second wavelength range. The light-emitting diode chip is located on the circuit substrate without overlapping the structure in a vertical direction. The light-emitting diode chip emits a third color light with a third wavelength range. The first wavelength range is between the second wavelength range and the third wavelength range.