LED Pixel Architecture With Integrated Control for TFT-Less Displays
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Solution Overview
Problem
Existing optoelectronic devices with light-emitting diodes face challenges in manufacturing complexity due to the need for precise alignment and increased component transfers, which are incompatible with industrial-scale production, especially for high-resolution displays requiring active arrays without thin film transistors (TFTs).
Innovation Solution
The development of an optoelectronic device with a TFT-less active array that integrates control electronics under each pixel, utilizing a support with conductive layers and photoluminescent blocks, and semiconductor walls to simplify the assembly process and reduce alignment accuracy requirements, allowing for faster and cost-effective manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the pick and place method is used to manufacture optoelectronic devices with light-emitting diodes, then the device can be assembled with separate components, but the manufacturing complexity increases due to the need for precise alignment and multiple component transfers
Solution Approach 1:
The patent merges the light-emitting diode and control circuit into a single integrated pixel structure. The control circuit is formed directly on the same substrate as the light-emitting diode, eliminating the need for separate placement and alignment operations. This integration directly resolves the technical contradiction by combining multiple components into one, thereby simplifying manufacturing while reducing alignment precision requirements.
2Measurement precision
If the resolution of the optoelectronic device is increased, then the image quality improves, but the manufacturing duration increases due to the increased number of light-emitting diode transfers required
Solution Approach 1:
By integrating the control circuit with the light-emitting diode in a single pixel structure, the patent enables all components to be manufactured simultaneously in one batch process. This eliminates the need for multiple sequential transfer operations that would otherwise be required for high-resolution displays, thereby maintaining high manufacturing speed while achieving high display resolution.
3Adaptability or versatility
If control circuits are assembled separately with light-emitting diodes and coupled by wires, then the device can be manufactured with modular components, but the data transmission capacity decreases and video flow display becomes difficult
Solution Approach 1:
The patent integrates the control circuit directly into the pixel structure on the same substrate, creating a unified device that eliminates wire coupling. This integration provides abundant data transmission channels within the pixel, enabling high-capacity data transmission and video flow display while maintaining the benefits of modular pixel design for assembly flexibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables the production of high-resolution displays with reduced manufacturing complexity and cost, facilitating industrial-scale production by integrating control electronics within each pixel, thus simplifying the assembly process and improving alignment accuracy.
Implementation Method 1
photoluminescent blocks covering the light-emitting diodes
Data Source
AI summary
An optoelectronic device including a support, at least a first conductive layer covering the support, display pixels including first and second opposite surfaces, bonded to the first conductive layer, each pixel including an electronic circuit including the first surface and a third surface opposite to the first surface, the first surface being bonded to the first conductive layer, and an optoelectronic circuit bonded to the third surface and including at least two light-emitting diodes, at least one of the electrodes of each light-emitting diode being connected to the electronic circuit by the third surface, the optoelectronic circuit further comprising photoluminescent blocks covering the light-emitting diodes and conductive or semiconductor walls surrounding the photoluminescent blocks, and at least one second conductive layer electrically coupled to at least one of the pixels.