LED Pixel Packaging Structure for Smaller High-Density Displays
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Solution Overview
Problem
The challenge in the field of solid-state lighting is to manufacture LED pixels with smaller volumes while maintaining their optical and electrical properties, which is essential for advancing display technologies.
Innovation Solution
The development of a light-emitting display module comprising a board with encapsulated light-emitting diode modules arranged in an array configuration, where each module includes optoelectronic units surrounded by a supporting structure and a fence, allowing for efficient light emission and mechanical support, enabling the creation of smaller LED pixels with enhanced packaging density.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If traditional LED packaging structures are used, then mechanical strength and structural support are maintained, but the volume of LED pixels cannot be reduced sufficiently
Solution Approach 1:
The LED module is divided into multiple encapsulated light-emitting units, each containing a specific number of optoelectronic units. This segmentation allows for compact arrangement and reduced overall volume while maintaining structural integrity through modular design.
Solution Approach 2:
Multiple optoelectronic units are nested within a single encapsulated light-emitting unit, which is in turn encapsulated by the supporting structure. This nested arrangement maximizes space utilization and reduces the volume of each LED pixel while preserving mechanical strength.
2Productivity
If LED pixels are made smaller to increase packaging density, then display resolution is improved, but optical efficiency and light emission quality may deteriorate
Solution Approach 1:
The supporting structure extends in multiple dimensions to provide comprehensive enclosure and support for the optoelectronic units. This multi-dimensional support system maintains optical efficiency and light emission quality even as the overall pixel volume is reduced through compact arrangement.
Solution Approach 2:
The encapsulating material used in the supporting structure and fence is designed to be transparent or translucent, allowing efficient light transmission while providing mechanical protection. This composite approach maintains optical efficiency despite the reduced size of individual pixels.
3Reliability
If more optoelectronic units are integrated into each pixel to improve display quality, then the complexity of the packaging structure increases
Solution Approach 1:
Multiple optoelectronic units are merged into a single encapsulated light-emitting unit, sharing common supporting structures and fencing. This merging approach allows multiple units to be integrated into each pixel while reducing packaging complexity through shared components and standardized enclosure designs.
Solution Approach 2:
The supporting structure and fence serve multiple functions simultaneously: mechanical support, structural enclosure, optical transmission, and protection of optoelectronic units. This multi-functionality reduces the need for separate components, thereby simplifying the overall packaging structure despite integrating multiple optoelectronic units.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables the production of smaller LED pixels with improved mechanical strength and optical efficiency, paving the way for higher resolution and denser LED display modules.
Implementation Method 1
The light-emitting display module comprises: a board; and a plurality of light-emitting diode modules arranged in an array configuration on the board
Data Source
AI summary
A light-emitting module including a first optoelectronic unit having a first electrode pad and a second electrode pad, a second optoelectronic unit having a third electrode pad and a fourth electrode pad, a first supporting structure enclosing the first optoelectronic unit and the second optoelectronic unit, a first pin overlapping and confronted with both of the first electrode pad and the third electrode pad, a second pin overlapping the second electrode pad and the first supporting structure, and a third pin overlapping the fourth electrode pad and physically separated from the second pin.