LED Pixel Packaging Structure for Smaller High-Density Displays
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Solution Overview
Problem
The challenge in the field of solid-state lighting is to manufacture LED pixels with smaller volumes while maintaining their optical and electrical properties, which is essential for advancing display technology.
Innovation Solution
The development of a light-emitting display module comprising a board with encapsulated light-emitting diode modules arranged in an array configuration, where each module includes optoelectronic units surrounded by a supporting structure and a fence, allowing for efficient packaging and increased mechanical strength, and enabling smaller form factors without compromising performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If traditional LED packaging structures are used, then the mechanical strength and optical efficiency are maintained, but the volume of LED pixels cannot be reduced
Solution Approach 1:
The patent divides the LED packaging structure into multiple functional components: a support structure for mechanical strength, a reflective layer for optical efficiency, and a transparent encapsulant for protection. This segmentation allows each component to be optimized independently, reducing overall volume while maintaining performance
Solution Approach 2:
The patent implements a nested structure where the reflective layer is positioned within the encapsulated LED unit, and multiple optoelectronic units are arranged in a compact configuration. This nesting approach maximizes space utilization and reduces the overall pixel volume
2Productivity
If traditional LED packaging structures are used, then the mechanical strength and optical efficiency are maintained, but the density of LED display modules is low
Solution Approach 1:
The patent merges multiple functions into a single integrated packaging structure that provides mechanical support, optical reflection, and environmental protection simultaneously. This consolidation increases display module density by reducing the space required for separate components
Solution Approach 2:
The patent arranges multiple optoelectronic units in a three-dimensional configuration within the encapsulated unit, utilizing vertical and horizontal space efficiently. This multi-dimensional arrangement increases the density of LED display modules
3Length of moving object
If smaller LED pixels are manufactured, then the form factor is reduced, but the mechanical strength and optical efficiency may be compromised
Solution Approach 1:
The patent applies different material properties to different regions of the packaging structure: a reflective material for optical efficiency, a transparent material for protection, and structurally optimized geometries for mechanical strength. This local optimization maintains reliability in smaller form factors
Solution Approach 2:
The patent uses composite packaging structures combining materials with different properties - reflective layers for light management, transparent encapsulants for protection, and structurally reinforced geometries. This composite approach maintains optical and mechanical performance in reduced-size pixels
Data Source
AI summary
This disclosure discloses a light-emitting display module display. The light-emitting display module comprises: a board; and a plurality of light-emitting diode modules arranged in an array configuration on the board; wherein one of the light-emitting diode modules comprises a plurality of encapsulated light-emitting units spaced apart from each other; and one of the encapsulated light-emitting units comprises a plurality of optoelectronic units, a first supporting, and a fence; and wherein the plurality of optoelectronic units are covered by the first supporting structure, and the fence surrounds the first supporting structure and the plurality of optoelectronic units.