LED Pixel Repair Bonding Structure for High-Resolution Displays
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Solution Overview
Problem
Miniaturized LEDs in display devices lack mechanical strength, making them prone to damage, and repairing or replacing damaged pixels is challenging due to their small size and large quantity, complicating maintenance.
Innovation Solution
A method involving the removal of a damaged LED unit, planarization of the removal surface, and reattachment of a new LED unit using a bonding structure comprising conductive bodies and an insulating structure to enhance mechanical strength and facilitate repair.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If LEDs are miniaturized for high-resolution displays, then display resolution is improved, but mechanical strength of LEDs deteriorates making them prone to breakage
Solution Approach 1:
The patent divides the LED structure into separable components: a removable light emitting unit and a reusable carrier board with bonding structures. This allows the fragile miniaturized LED to be handled as a modular unit that can be replaced without damaging the carrier board, resolving the contradiction between miniaturization and mechanical strength.
Solution Approach 2:
The patent pre-establishes bonding structures (conductive bodies and insulating structures) on the carrier board before the LED is mounted. These pre-formed structures provide mechanical support and electrical connectivity, enabling the fragile miniaturized LED to be securely attached without requiring complex assembly procedures that could cause damage.
2Reliability
If damaged LEDs need to be replaced, then display reliability can be restored, but the complexity of removal and replacement procedures increases due to small size and large quantity of LEDs
Solution Approach 1:
The patent segments the LED assembly into a removable light emitting unit and a stationary carrier board. The light emitting unit can be removed as a complete unit by breaking the simple bonding connection, allowing replacement without complex disassembly of the entire display structure. This maintains reliability while reducing repair complexity.
Solution Approach 2:
The patent extracts the light emitting unit from the carrier board as a separable component. The carrier board retains the bonding structures which remain after removal, allowing the damaged LED unit to be extracted and replaced without affecting the underlying mounting infrastructure, thereby simplifying the repair process.
3Reliability
If a bonding structure with conductive bodies and insulating structure is used, then electrical connectivity and mechanical integrity are improved, but the device structure becomes more complex
Solution Approach 1:
The patent merges the electrical connection function and mechanical support function into a single integrated bonding structure on the carrier board. The conductive bodies provide electrical connectivity while the insulating structure provides mechanical support and electrical isolation, combining multiple functions in one compact structure that does not significantly increase overall device complexity.
Solution Approach 2:
The patent introduces an insulating structure as an intermediary between the conductive bodies and the light emitting unit. This intermediary component provides mechanical support and electrical isolation, enabling reliable bonding without requiring complex direct connections, thereby maintaining structural simplicity while achieving high reliability.
Data Source
AI summary
A method of repairing a light emitting device, comprises: providing a light emitting device comprising a carrier board and a first light emitting unit; destroying the first light emitting unit and forming a removal surface on the light emitting device; planarizing the removal surface; providing a bonding structure on the removal surface; and fixing a second light emitting unit on the planarized removal surface through the bonding material.