LED Display Pixel Routing via Lateral Line Extraction
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Solution Overview
Problem
The existing layout design of LED display devices requires four via holes per pixel, leading to increased pixel spacing, low resolution, and complex production processes due to the large area occupied by via holes and metal lines.
Innovation Solution
The LED display device design incorporates a substrate with pixel units featuring three LEDs of different colors, utilizing a lateral through line in each row and three vertical through lines in each column, reducing the number of via holes to three per pixel unit, which allows for closer pixel spacing and simplifies the production process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If four via holes are drilled on a substrate for each pixel, then the electrical connection is achieved, but the pixel area increases and the distance between pixels increases
Solution Approach 1:
The patent extracts the lateral metal line from the substrate interior to the substrate surface, eliminating the need for lateral via holes. Only three vertical via holes are drilled through the substrate thickness direction, reducing the total via hole count from four to three per pixel while maintaining electrical connectivity
Solution Approach 2:
The invention changes the routing dimension of metal lines from in-plane (lateral) to out-of-plane (vertical) by bringing lateral lines to the substrate surface and connecting them to LED electrodes through vertical via holes, reducing the area occupied by via holes in the pixel plane
2Reliability
If four via holes are drilled on a substrate for each pixel, then the electrical connection is achieved, but the resolution decreases and the image becomes unclear
Solution Approach 1:
By extracting the lateral metal line routing to the substrate surface and eliminating lateral via holes, the design reduces the number of via holes from four to three per pixel, decreasing the occupied area and enabling smaller pixel pitch for higher resolution displays
Solution Approach 2:
The invention changes the via hole configuration parameter from four lateral via holes to three vertical via holes, altering the spatial arrangement and reducing the minimum pixel pitch requirement, thereby improving display resolution
3Reliability
If four via holes and five metal lines are used in each pixel, then the electrical connection is achieved, but the production process becomes complex and expensive
Solution Approach 1:
The patent extracts the lateral metal line from the substrate interior to the substrate surface, eliminating the need for lateral via holes and reducing the total via hole count from four to three per pixel, thereby simplifying the production process
Solution Approach 2:
The invention merges the lateral metal line routing with the substrate surface level, combining the functions of lateral connection and vertical connection through a unified via hole structure, reducing the total number of via holes and simplifying the manufacturing process
Data Source
AI summary
A LED display device is provided in the present disclosure, including multiple pixel units arranged in array on the substrate. Each of the pixel units includes three LEDs with different emitting colors. In each row of the pixel units, a first electrode of each LED is connected directly with a lateral through line. In each column of the pixel units, a second electrode of a red LED is electrically connected with a first vertical through line via a first via hole, a second electrode of a green LED is electrically connected with a second vertical through line via a second via hole, and a second electrode of a blue LED is electrically connected with a second vertical through line via a third via hole.