Integrated PL Material for LED Light Infusing
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Solution Overview
Problem
Conventional white LED package structures face challenges in achieving a uniform light infusing effect due to the complexity of matching fluorescent powder and diffusion layer materials, particle size, and distribution density, which complicates production and increases costs.
Innovation Solution
The use of a photoluminescent material (PL material) that serves as both a fluorescent layer and diffusion layer, excited by the LED chip to scatter light, simplifying the production process and enhancing light infusing effects by eliminating the need for separate matching of materials and particle distributions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If separate fluorescent layer and diffusion layer are used with multiple materials and particle distributions, then light infusing effect can be improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent combines the fluorescent layer and diffusion layer into a single integrated layer containing both fluorescent particles and diffusion particles. This merging eliminates the need for separate layers and their complex matching, while achieving both light conversion and light scattering functions simultaneously, thus improving the light infusing effect without increasing structural complexity
Solution Approach 2:
The single layer in the patent performs multiple functions: it converts light wavelength through fluorescent particles and scatters light through diffusion particles. This multi-functional design eliminates the need for separate specialized layers, simplifying the overall structure while maintaining effective light infusing performance
2Illumination intensity
If multiple materials and particle distributions are matched for fluorescent layer and diffusion layer, then light infusing effect can be improved, but manufacturing precision requirements increase
Solution Approach 1:
By merging fluorescent particles and diffusion particles into a single layer, the patent eliminates the need for precise matching between separate fluorescent and diffusion layers. The unified structure allows both particle types to coexist and function together without requiring complex inter-layer alignment or density matching
Solution Approach 2:
The patent creates a homogeneous mixture of fluorescent particles and diffusion particles within a single layer matrix. This homogeneous distribution simplifies manufacturing by eliminating the need for precise control of particle distribution gradients or density variations that would be required in multi-layer structures
3Illumination intensity
If conventional fluorescent powder and diffusion layer are used separately, then production process becomes complex, but light infusing effect can be achieved
Solution Approach 1:
The patent merges the functions of fluorescent powder and diffusion layer into a single integrated layer, which dramatically simplifies the production process. Instead of requiring separate application, curing, and alignment steps for two different layers, the manufacturing process now requires only a single layer application with mixed particles, reducing process complexity while maintaining effective light infusing
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The PL material achieves a better light infusing effect by uniformly blending light emitted from the LED chip with light excited by the PL material, simplifying the fabrication process and reducing production costs while maintaining high luminous efficiency.
Implementation Method 1
the photoluminescent material is adapted to be excited by the light emitted from the LED chip and to scatter the light
Data Source
AI summary
An LED package structure including a carrier, an LED chip, an encapsulant and a PL material is provided, wherein the LED chip is disposed on the carrier for emitting light. The encapsulant encapsulates the LED chip. The PL material is distributed in the encapsulant. The PL material is suitable for being excited by the light emitted from the LED chip and scattering the light. Moreover, the present invention provides a novel PL material with a molecular formula of WmMon(Y,Ce,Tb,Gd,Sc)3+t+u(Al,Ga,Tl,In,B)5+u+2v(O,S,Se)12+2t+3u+3v+3m+3n: Ce3+, Tb3+, wherein 0<t<5 and 0<m, n, u, v<15.