LED Electrode Plating Layout for Non-Transparent Substrate Mounting
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Solution Overview
Problem
The challenge of mounting a light emitting element on a wiring substrate is exacerbated by the use of non-transparent substrates, such as Si, as irradiated light cannot pass through, hindering suitable attachment and connection methods.
Innovation Solution
A method involving the formation of resist patterns on the substrate to secure a space for plating connections between the light emitting element electrodes and wiring seed layers, allowing for the use of both transparent and non-transparent substrates, with the resist pattern acting as a mask for plating and ensuring adhesion and electrical connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a non-transparent substrate is used to achieve high thermal conductivity and high integration, then thermal management and circuit integration are improved, but light transmission is blocked preventing adhesive curing
Solution Approach 1:
The patent introduces a transparent adhesive layer as an intermediary between the non-transparent substrate and the light emitting element. This adhesive layer allows light to pass through for curing while maintaining the thermal conductivity benefits of the non-transparent substrate. The adhesive serves as a mediator that resolves the conflict between optical transparency requirements and thermal management requirements.
Solution Approach 2:
The patent segments the functional requirements by separating the substrate's thermal management function from the adhesive's optical transmission function. The substrate provides thermal conductivity while the adhesive layer provides light transmission for curing, allowing each component to optimize its specific function without compromising the other.
2Ease of manufacture
If light irradiation is used to cure adhesive on transparent substrates, then adhesive bonding is achieved, but the method cannot be applied to non-transparent substrates
Solution Approach 1:
The patent makes the manufacturing process universal by using a transparent adhesive layer that can be cured through light irradiation regardless of the substrate's transparency. This approach allows the same bonding method to be applied to both transparent and non-transparent substrates, enhancing process versatility and adaptability.
3Reliability
If electrodes are connected through plating after adhesive removal, then electrical connectivity is achieved, but the process becomes complex and time-consuming
Solution Approach 1:
The patent performs preliminary actions by forming through-holes and applying conductive material before final adhesive removal and element mounting. This sequencing allows electrical connections to be prepared in advance, simplifying the overall process and improving manufacturing efficiency while ensuring reliable electrical connectivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the suitable mounting of light emitting elements on both transparent and non-transparent substrates without the need for irradiating the substrate surface, simplifying the manufacturing process and ensuring reliable electrical connections.
Implementation Method 1
forming a resist pattern, at least a part of which is within an area on the substrate where the light emitting element is to be placed
Implementation Method 2
joining the first wiring seed layer with the p-side electrode disposed separately from the first wiring seed layer, and joining the second wiring seed layer with the n-side electrode disposed separately from the second wiring seed layer, by plating using the resist pattern as a mask
Data Source
AI summary
A light emitting device includes: a wiring substrate including: a substrate, and a first wiring and a second wiring disposed on the substrate; a light emitting element located above the wiring substrate and including a first electrode and a second electrode; a first conductive member connecting the first wiring and the first electrode; and a second conductive member connecting the second wiring and the second electrode. An outer lateral surface of the first conductive member protrudes outward from a straight line that connects an outer end of the first wiring and an outer end of the first electrode in a cross-sectional view.