LED Substrate Packaging With Polymer Gap Control
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Solution Overview
Problem
Existing electronic devices face challenges in extending their operating service life and improving packaging techniques, particularly in the integration of light-emitting diodes, due to issues such as air gaps and material interference that can lead to defects and reduced reliability.
Innovation Solution
The electronic device incorporates a first substrate body with light-emitting diodes, a second substrate body, and polymer elements disposed in specific regions, with a transparent material layer and sealing material to minimize air gaps and enhance structural integrity, using materials with varying viscosities and hardnesses to improve assembly reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If light-emitting diodes are integrated between substrates, then device functionality is improved, but air gaps and material interference cause defects and reduced reliability
Solution Approach 1:
A polymer element is introduced as an intermediary material between the light-emitting diodes and the second substrate body. This polymer element fills the space that would otherwise contain air gaps, eliminating the harmful air interfaces while providing proper mechanical support and optical properties for the LED operation
Solution Approach 2:
The refractive index of the polymer element is specifically designed to match or closely approximate the refractive index of the light-emitting diode materials. This parameter matching eliminates optical interference and material interface problems, allowing efficient light transmission without defects
2Manufacturing precision
If polymer elements are used to fill spaces between substrates, then air gaps are reduced, but manufacturing precision requirements increase
Solution Approach 1:
The polymer element is applied as a thin film or coating layer between the substrates. This flexible application method allows the polymer to conform to the substrate surfaces and fill irregular spaces uniformly, achieving precise gap control without requiring complex rigid structures
Solution Approach 2:
The packaging structure uses composite materials combining the first substrate body, light-emitting diodes, polymer element, and second substrate body. Each material is selected for its specific properties, and their combination creates a unified structure that simplifies manufacturing while maintaining high precision
Data Source
AI summary
An electronic device including a first substrate body, a plurality of light-emitting diodes, a second substrate body, a first polymer element, and a second polymer element is provided. The first substrate body has a light-emitting region and a non-light-emitting region adjacent to the light-emitting region. The plurality of light-emitting diodes are disposed on the first substrate body. The second substrate body is disposed opposite to the first substrate body. The first polymer element is disposed between the plurality of light-emitting diodes and the second substrate body, and disposed in the light-emitting region. The second polymer element is disposed between the first substrate body and the second substrate body, and disposed in the non-light-emitting region. There is a distance between a top surface of the second polymer element and a bottom surface of the second substrate body, and the distance is greater than 0.