Integrated LED Bulb with Polymer Lens and Conductive Substrate
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Solution Overview
Problem
The complexity and inefficiency of solid state lighting systems, including multiple layers of packaging, lead to increased size, cost, and reduced light and heat extraction efficiency, as well as reduced optical performance due to light absorption at each packaging layer.
Innovation Solution
An LED is mounted on an electrically conducting substrate with external portions for power connection, and a thermally conductive, electrically insulating polymer body is molded around the LED and lens, integrating the components into a single unit that reduces packaging layers and enhances heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple layers of packaging (LED package, PCB, secondary optics, bulb) are used, then the structural integrity and electrical connection are improved, but the device size increases and manufacturing complexity increases
Solution Approach 1:
The patent combines multiple separate packaging layers (LED package, PCB, secondary optics, bulb) into a single integrated LED bulb assembly. The LED chip is mounted directly on a support structure within the bulb housing, eliminating the need for separate LED packages and PCB assemblies. This merging reduces the number of components and simplifies manufacturing while maintaining structural integrity through the integrated design.
2Reliability
If multiple layers of packaging are used, then electrical connection and structural support are improved, but light extraction efficiency deteriorates due to light absorption at each layer
Solution Approach 1:
The patent removes intermediate packaging layers (LED package, PCB) that absorb light between the LED chip and the final light output. By mounting the LED chip directly on the support structure within the bulb, the light path is shortened and fewer absorbing layers are present, thereby improving light extraction efficiency while maintaining necessary electrical connections through the support structure's conductive elements.
3Reliability
If multiple layers of packaging are used, then electrical connection and structural support are improved, but heat extraction efficiency deteriorates
Solution Approach 1:
The patent integrates the heat dissipation function directly into the support structure that holds the LED chip. The support structure includes thermally conductive elements that are in direct contact with the LED chip's heat-generating regions, providing an efficient thermal pathway to the bulb housing and ultimately to the ambient environment. This eliminates thermal resistance at multiple packaging interfaces and improves overall heat extraction efficiency.
4Reliability
If traditional LED packaging layers are used, then electrical connection is improved, but the number of components and assembly steps increase
Solution Approach 1:
The patent merges the LED mounting structure, electrical connection elements, and mechanical support into a single integrated assembly. The support structure incorporates both mechanical support features and electrical connection pathways, allowing the LED chip to be mounted and electrically connected in a single assembly step rather than requiring separate steps for package attachment, PCB mounting, and wire bonding. This significantly reduces assembly complexity and improves manufacturing productivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution simplifies manufacturing, enhances light extraction, and improves heat management, resulting in a more efficient and cost-effective solid state lighting system with improved optical performance.
Implementation Method 1
The polymer body is thermally conductive and electrically insulating
Implementation Method 2
Semiconductor light-emitting devices including light emitting diodes (LEDs)
Data Source
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AI summary
A device according to embodiments of the invention includes a light emitting diode (LED) mounted on an electrically conducting substrate. A lens is disposed over the LED. A polymer body is molded over the electrically conducting substrate and in direct contact with the lens.