LED Package Position Indicator for Mounting Accuracy
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current LED packages face challenges in optimizing brightness levels due to slight deviations in LED mounting positions, leading to variations in brightness and poor contact during wire bonding, resulting in economic losses.
Innovation Solution
The implementation of a position indicator on the lead frame with specific patterns to guide the accurate mounting of the LED chip, ensuring optimal brightness and preventing poor contact during wire bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If rough mounting position checking is used during die bonding, then mounting process simplicity is maintained, but LED mounting position accuracy deteriorates, causing brightness variations
Solution Approach 1:
The patent applies preliminary action by pre-forming indentation patterns on the lead frame before the mounting process. These patterns serve as position indicators that guide the LED chip placement, allowing operators to accurately identify the mounting position without complex measurement tools during the actual bonding process. This resolves the contradiction by preparing the positioning information in advance, maintaining process simplicity while achieving high positioning accuracy.
2Illumination intensity
If LED mounting position varies, then some packages may have higher brightness, but brightness uniformity across all packages deteriorates
Solution Approach 1:
The indentation patterns are pre-formed on the lead frame to establish precise mounting positions before LED chips are attached. This ensures that all LEDs are mounted at the optimal position for maximum brightness while maintaining consistent positioning across all packages, thereby achieving both high brightness and uniformity.
3Reliability
If LED mounting position deviates, then wire bonding contact quality deteriorates, but no additional positioning mechanism is added
Solution Approach 1:
The position indicator patterns are pre-formed on the lead frame during lead frame manufacturing, before the mounting and wire bonding processes. These patterns provide visual guidance for accurate LED placement, ensuring good wire bonding contact without requiring complex additional positioning mechanisms or tools during assembly.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The position indicator significantly reduces variations in brightness levels, enhancing the LED package's brightness by over 50% and minimizing discarded products due to poor contact, thereby improving manufacturing efficiency.
Implementation Method 1
a light emitting diode (LED) is an electronic component that makes charge-carriers (electrons or holes) by the use of pn junctions, recombines them, converts electrical energy into light energy, and emits light
Data Source
AI summary
There is provided a light emitting diode package, including a package body including a recess portion having a housing space and a lead frame mounted on the recess portion to be exposed; a light emitting diode chip mounted to be electrically connected to the lead frame; and a position indicator formed on the lead frame and guiding the mounting position of the light emitting diode chip.