Light-emitting Device Positioning Member Alignment Groove
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Achieving precise positional alignment between LED light-emitting elements and microlens arrays in light-emitting devices is challenging due to assembly accuracy issues, such as tolerances in mounting substrate holes and pin diameters, which affects the optical axis alignment and overall performance.
Innovation Solution
A light-emitting device design featuring a metal positioning member and a second land pattern on the mounting substrate, divided by a groove portion, to align the optical axes of light-emitting elements and optical elements, with a bonding member used to fix the positioning member, improving positional accuracy through controlled bonding member dispersion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a mounting hole and mounting pin assembly method is used to align the LED and microlens array, then the assembly process is simple, but the positional accuracy deteriorates due to accumulated tolerances
Solution Approach 1:
A positioning member made of metal is introduced as an intermediary component between the mounting substrate and the microlens array. This positioning member includes a positioning protrusion that fits into a positioning recess, providing a dedicated alignment mechanism that ensures precise optical axis alignment without relying solely on the mounting hole and pin assembly. The positioning member acts as a mediator that transfers and maintains the required positional accuracy from the mounting substrate to the optical components.
Solution Approach 2:
The alignment function is segmented into multiple independent features: the mounting hole for mechanical support, the positioning protrusion and recess for precise alignment, and the bonding member for fixation. By dividing the alignment task into separate functional elements, each optimized for its specific purpose, the system achieves both ease of manufacture and high positional accuracy without the tolerances accumulating in a single assembly step.
2Adaptability or versatility
If tolerances in mounting substrate hole, hole diameter, pin position, and pin diameter are accumulated, then the assembly process remains flexible, but the assembling accuracy deteriorates
Solution Approach 1:
The positioning member serves as an intermediary that decouples the tolerance accumulation in the mounting substrate from the final optical alignment. The positioning protrusion and recess provide a dedicated alignment interface with controlled tolerances, preventing the propagation of accumulated errors from earlier assembly steps to the critical optical axis alignment.
3Ease of manufacture
If the bonding member is applied without dispersion control, then the application process is simple, but the positioning accuracy deteriorates due to bonding member flow
Solution Approach 1:
The bonding member application area is segmented by dividing the second land pattern into multiple regions separated by groove portions. This segmentation confines the bonding member to specific areas, preventing it from flowing laterally and displacing the positioning member. The grooves act as barriers that maintain the positioning accuracy while still allowing simple bonding member application through dispensing or printing methods.
4Manufacturing precision
If the second land pattern is divided into multiple regions separated by groove portions, then the bonding member dispersion is controlled, but the structure complexity increases
Solution Approach 1:
The second land pattern is divided into multiple regions by groove portions, creating a segmented structure that controls bonding member dispersion. The grooves are simple recesses that can be easily formed by conventional PCB fabrication techniques, adding minimal structural complexity while effectively preventing bonding member flow and maintaining positioning accuracy.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances positional accuracy and reduces deviations in the alignment of optical and light-emitting elements, leading to improved performance and consistency in light-emitting devices by uniformly dispersing the bonding member and stabilizing the positioning member's position.
Implementation Method 1
mounting the one or more light-emitting elements and the positioning member by melting the bonding member on the first land pattern and the bonding member on the second land pattern
Implementation Method 2
a bonding member configured to fix the second land pattern and the positioning member to each other
Data Source
AI summary
A light-emitting device includes one or more light-emitting elements having an optical axis, a mounting substrate on which the one or more light-emitting elements are placed on a first land pattern, one or more optical elements having an optical axis, a positioning member made of metal and configured to define a relative position between the one or more optical elements and the one or more light-emitting elements such that the optical axis of the one or more optical elements and the optical axis of the one or more light-emitting elements are aligned with each other, a second land pattern formed on the mounting substrate and configured to fix one surface of the positioning member, and a bonding member configured to fix the second land pattern and the positioning member to each other. The second land pattern is divided into a plurality of regions separated by a groove portion.