Light-Emitting Device Power Line Segmentation and Electroplating
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Solution Overview
Problem
In light-emitting devices, high resistance in signal and power lines leads to current crowding and IR drop, reducing the luminance and display quality as the number of LEDs increases, and shortening their service life.
Innovation Solution
A manufacturing method that forms conductive patterns and wire patterns on a substrate with seed patterns, allowing for the simultaneous electroplating of pads and power lines using low-resistance materials like copper, silver, or gold, which reduces the resistance of power lines and simplifies the process, thereby minimizing current crowding and IR drop.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If fine signal lines or power lines are used to connect circuit units and LEDs, then the device complexity is reduced and area is minimized, but the resistance increases causing current crowding and IR drop
Solution Approach 1:
The patent divides the power line into multiple parallel segments (first power line and second power line) that run alongside the signal line. This segmentation reduces the resistance of each individual power line segment, thereby reducing IR drop and current crowding while maintaining a compact layout.
Solution Approach 2:
The patent creates a multi-functional conductive structure where the first and second power lines serve both as power supply paths and as part of the overall interconnect architecture. This multi-functional design reduces resistance without requiring separate dedicated thick power lines, thus maintaining area efficiency.
2Area of stationary object
If the total number of LEDs is increased to improve display coverage, then the display area is increased, but the IR drop increases and luminance of each LED is reduced
Solution Approach 1:
The patent segments the power distribution network into multiple parallel power lines (first and second power lines) that distribute power to different groups of LEDs. This segmentation reduces the current load on each power line, minimizing IR drop and ensuring uniform luminance across all LEDs even when the total number of LEDs is increased.
3Ease of manufacture
If conventional separate formation of power lines and pads is used, then the manufacturing process is straightforward, but the resistance of power lines remains high and current crowding occurs
Solution Approach 1:
The patent merges the formation of power lines and pads into a single simultaneous electroplating process. The first and second power lines along with first and second pads are formed together from seed patterns, reducing manufacturing steps while creating a low-resistance power distribution network that prevents current crowding.
4Reliability
If simultaneous electroplating of pads and power lines is implemented using low-resistance materials, then the resistance is reduced and current crowding is minimized, but the manufacturing process complexity increases
Solution Approach 1:
The patent combines multiple manufacturing operations into a single simultaneous electroplating step that forms power lines and pads together from pre-formed seed patterns. This merging approach actually reduces overall process complexity compared to separate formation steps, while achieving low resistance and uniform current distribution.
Solution Approach 2:
The patent performs preliminary actions by forming seed patterns for power lines and pads before the electroplating step. These seed patterns are prepared in advance on the substrate, allowing the subsequent simultaneous electroplating to proceed efficiently without requiring complex in-situ pattern formation during the plating process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces energy consumption, increases the brightness and uniformity of light-emitting elements, extends their service life, and enhances the overall quality of the light-emitting device by maintaining suitable operating voltages and reducing voltage drops.
Implementation Method 1
voltage is applied to the first conductive pattern and the second conductive pattern and the first pad and the second pad are formed by an electroplating method
Implementation Method 2
The method of forming the first seed pattern and the second seed pattern comprises a sputtering method
Implementation Method 3
The method of forming the first seed pattern and the second seed pattern comprises a thermal evaporation method
Implementation Method 4
The method of forming the first seed pattern and the second seed pattern comprises an electron gun (E-Gun) vacuum evaporation method
Implementation Method 5
The method of forming the first seed pattern and the second seed pattern comprises an atomic layer chemical vapor deposition method
Data Source
AI summary
A light-emitting device includes a substrate, a circuit array including a plurality of circuit units disposed on the substrate, a first conductive pattern, a second conductive pattern, a first wire pattern, and a second wire pattern disposed on the circuit array, and a light-emitting element disposed on one of the circuit units. The light-emitting element includes a first electrode and a second electrode respectively electrically connected to the first conductive pattern and the second conductive pattern. The second electrode is not overlapped with the first wire pattern and the second wire pattern. A manufacturing method of the light-emitting device is also provided.