LED Device with Integrated Protection via Substrate Conductive Layer
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Solution Overview
Problem
The integration of a protection device in semiconductor light emitting devices is hindered by increased area requirements and complex device structures, especially in LED arrays driven by AC voltage, making miniaturization and complex wiring connections difficult.
Innovation Solution
A light emitting device with a new wiring connection structure that integrates a protection device, featuring semiconductor stacked structures with conductive layers and insulation layers, allowing for exposed areas on the substrate for connection terminals and wiring layers to facilitate AC driving while minimizing device complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a zener diode protection device is additionally mounted to prevent breakdown, then reliability is improved, but device area increases and structure becomes more complex
Solution Approach 1:
The patent merges the protection device function with the substrate structure by forming a conductive layer that extends from the contact through the insulation layer to the substrate. This integration eliminates the need for separate protection devices while maintaining the protection function, thereby reducing device area and structural complexity.
Solution Approach 2:
The substrate structure is designed to serve multiple functions: it provides mechanical support, electrical connection, and protection device functionality through the integrated conductive layer. This multi-functionality reduces the overall device complexity and area requirements.
2Reliability
If additional protection devices are mounted in LED arrays with complex wiring, then reliability is improved, but manufacturing difficulty increases and miniaturization becomes difficult
Solution Approach 1:
The protection device is merged into the substrate structure through the conductive layer extension, eliminating separate mounting steps and simplifying the manufacturing process for LED arrays with complex wiring connections.
Solution Approach 2:
The conductive layer is formed during the substrate preparation stage before final device assembly, integrating the protection function early in the manufacturing process and avoiding additional complex mounting steps later.
3Ease of operation
If bonding pad area is increased for external circuit connection, then ease of connection is improved, but device area increases and miniaturization is hindered
Solution Approach 1:
The conductive layer provides vertical extension for electrical connection, reducing the need for large horizontal bonding pad areas. This allows external circuit connections while maintaining compact device dimensions for miniaturization.
Data Source
AI summary
Provided are a light emitting device and a method of manufacturing the same. The light emitting device includes each of first and second semiconductor stacked structures including first and second conductive type semiconductor layers and an active layer, first and second contacts on tops and bottoms of the first and second semiconductor stacked structures to be connected to the first and second conductive type semiconductor layers, a substrate structure including first and second sides, a first insulation layer on an area where no second contact is formed among a surface of the first and second semiconductor stacked layers, first and second conductive layers connected to the second contacts of the first and second semiconductor stacked structures, first and second wiring layers on the first side of the substrate structure, and first and second external connection terminals connected to the first and second contacts of the first semiconductor stacked structure.