LED Assembly with Radial Ribs for Heat Dissipation

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Solution Overview

Problem

High output light emitting diodes (LEDs) generate significant heat when used in large numbers, reducing their lifespan, and existing heat dissipation solutions are not economically viable or efficient in managing heat transfer and light emission.

Innovation Solution

A light emitter assembly featuring substrates with thermally conductive ribs and a housing design that allows for air flow and efficient heat dissipation through natural convection, with radially extending ribs and strategically placed recesses to enhance thermal connection and light dispersion.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Illumination intensity

If a large number of high output LEDs are mounted on a common support, then illumination intensity is improved, but temperature increases and LED lifespan is reduced

Engineering Contradiction:
Improveillumination intensityVSAvoidoperating temperature
Core Design Contradiction:
Illumination intensityVSTemperature

Solution Approach 1:

The support structure is segmented into multiple thermally conductive ribs radiating from a central axis, with substrates mounted at different radial distances. This segmentation creates multiple thermal pathways and zones, allowing heat to be distributed and dissipated more effectively across the entire structure rather than concentrating at a single mounting point.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The invention transitions from a planar support structure to a three-dimensional radial configuration with ribs extending outward at angles from the central axis. This dimensional change creates additional thermal conduction pathways in multiple directions and facilitates natural convection currents by establishing vertical temperature gradients, thereby improving heat dissipation capability.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Temperature

If LEDs are placed in contact with heat dissipation surfaces, then temperature is reduced, but device complexity increases

Engineering Contradiction:
Improveoperating temperatureVSAvoiddevice complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The support structure serves multiple functions simultaneously: it provides mechanical support for mounting LEDs, conducts heat away from the LED junctions through its thermally conductive ribs, and facilitates natural convection by creating vertical temperature gradients. This multi-functionality eliminates the need for separate heat sink components, reducing overall device complexity while maintaining effective heat dissipation.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The invention merges the structural support function with the thermal management function into a single integrated component. The radially extending ribs that provide mechanical support also serve as heat conduction pathways, combining what would traditionally be separate elements (mounting structure and heat sink) into one unified design.

Inventive Principle:
Principle #5Merging (Combining)

3Volume of moving object

If substrates are positioned close together for compact design, then volume is reduced, but heat transfer efficiency is compromised

Engineering Contradiction:
Improveassembly volumeVSAvoidheat transfer efficiency
Core Design Contradiction:
Volume of moving objectVSLoss of energy

Solution Approach 1:

The substrate positions are arranged asymmetrically relative to the central axis, with substrates located at different radial distances and angular positions. This asymmetric arrangement optimizes the thermal conduction pathways from each LED to the central heat dissipation region while maintaining a compact overall footprint, allowing each substrate to access thermal pathways without interference from adjacent substrates.

Inventive Principle:
Principle #4Asymmetry

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively reduces operating temperatures of LEDs, prolongs their lifespan, and minimizes manufacturing costs by promoting efficient heat transfer and light emission while maintaining a simple design.

Implementation Method 1

the ribs abutting the light emitters or substrate for thermally connecting the light emitters or substrate to the housing

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

mutually connected thermally conductive ribs spaced apart for air flow therebetween

Methodology Applied
Scientific EffectNatural convection: Free Convection

Data Source

PatentUS7701055B2Light emitter assembly
Publication Date: 2010.04.20 HONG KONG APPLIED SCI & TECH RES INST
  • US7701055B2 patent drawing
  • US7701055B2 patent drawing
  • US7701055B2 patent drawing

AI summary

A plurality of disc-shaped substrates carry light emitters and are axially stacked, spaced apart, in a metal housing to dissipate the heat produced by the light emitters. The housing comprises mutually connected elongate planar ribs that abut the light emitters or substrates for thermally connecting the light emitters to the housing. The ribs have shoulders. The substrates are received between the ribs and abut the shoulders. The shoulders are positioned proximate each light emitter in intimate contact with the substrate for efficient heat dissipation.