LED Lighting Device with Rear-Mounted Elements on Flat Carrier

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Existing lighting devices face challenges in efficiently mounting LED elements on flat carriers for lighting applications, requiring both electrical and thermal connections while minimizing cost and size, especially for multiple LED elements.

Innovation Solution

A lighting device with a flat carrier featuring a cutout and reverse mounting of LED elements, where the mounting element is positioned on the rear surface with electrical contact portions on both sides, allowing for direct electrical connection and heat dissipation through a heat sink, enabling efficient thermal management and compact design.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If LED elements are mounted on a flat carrier using conventional methods, then electrical connection is achieved, but thermal management becomes difficult and device size increases

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoiddevice size

Core Design Contradiction:

TemperatureVSVolume of stationary object

Solution Approach 1:

The patent inverts the conventional mounting approach by positioning the mounting element on the rear surface of the flat carrier rather than the front surface. This allows the light-emitting face of LED elements to face away from the carrier, providing direct thermal access to the cooling interface on the rear surface while maintaining compact device dimensions. The mounting element serves dual purposes: electrical connection and thermal management.

Inventive Principle:

Principle #13The other way round (Inversion)

Solution Approach 2:

The mounting element is designed to perform multiple functions simultaneously: providing electrical connection to LED elements, serving as a thermal management interface, and enabling compact device integration. By combining these functions in a single component on the rear surface, the patent eliminates the need for separate thermal management systems, reducing overall device size.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Productivity

If multiple LED elements are mounted on a flat carrier, then lighting coverage is improved, but manufacturing complexity and cost increase

Engineering Contradiction:

Improvelighting coverageVSAvoidmanufacturing complexity

Core Design Contradiction:

ProductivityVSDevice complexity

Solution Approach 1:

The patent divides the lighting device into modular LED elements mounted on a common mounting element. Each LED element can be independently controlled and replaced, while sharing the common mounting infrastructure. This segmentation allows for scalable lighting coverage without proportionally increasing manufacturing complexity, as the mounting element and connection architecture remain standardized.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent enables flexible configuration of multiple LED elements by changing parameters such as the number of LEDs, their arrangement pattern, and individual control settings. This allows customization of lighting coverage for different applications without redesigning the entire device architecture, simplifying manufacturing while adapting to various lighting requirements.

Inventive Principle:

Principle #35Parameter changes

3Temperature

If conventional mounting methods are used for LED elements, then assembly is straightforward, but thermal access to LED elements is limited

Engineering Contradiction:

Improvethermal accessVSAvoidassembly simplicity

Core Design Contradiction:

TemperatureVSEase of manufacture

Solution Approach 1:

By inverting the mounting orientation and placing the mounting element on the rear surface, the patent provides direct thermal access to the LED elements through the mounting element's contact with the cooling interface. This eliminates the need for complex thermal pathways through the carrier board, simplifying both thermal management and assembly processes while improving heat dissipation efficiency.

Inventive Principle:

Principle #13The other way round (Inversion)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution allows for easy and accurate mounting of multiple LED elements with independent control, efficient heat dissipation, and cost-effective assembly, suitable for various lighting applications including large arrays of LEDs.

Implementation Method 1

a heat sink element which is positioned in thermal contact with the mounting element

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentEP3602626B1Lighting device with LED elements on a mounting element on a flat carrier and method of manufacturing the same

Publication Date: 2023.05.03 LUMILEDS LLC

Figure 1~2
Figure 3a~3b
Figure 4~5

AI summary

A lighting device and a method of manufacturing a lighting device (10) are described. A flat carrier (14) has front and rear surfaces (16, 18) facing in opposed front and rear directions. The carrier (14) comprises a cutout (40). A carrier-side electrical contact portion (26) is provided on the rear surface (18). A mounting element (30) comprises an LED element (12) and a mount-side electrical contact portion (36) electrically connected to the LED element (12). The mounting element (30) is arranged on the rear surface (18) such that an electrical contact is formed between the carrier-side and a mount-side electrical contact portions (26, 36), and such that the LED element (12) is arranged on or within the cutout (40) to emit light into the front direction. A heat sink element is positioned to the rear of the mounting element in thermal contact.