Side View LED Package Rear Portion Thickening for Mounting Alignment

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Solution Overview

Problem

Conventional side view LED packages are prone to misalignment during surface mounting on a PCB due to height differences between their front and rear portions, leading to reduced light emitting efficiency when projected into a light guide plate.

Innovation Solution

The side view LED package incorporates thickened portions on its rear portion to compensate for height differences, ensuring accurate surface mounting by providing a flush surface with the PCB, allowing for level attachment and reduced misalignment risks.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If the rear portion of the body is made narrower than the front portion for ease of manufacture, then the body can be easily separated from the mold, but the height difference between front and rear portions causes misalignment during surface mounting

Engineering Contradiction:
Improveease of mold separationVSAvoidmounting alignment precision
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

The patent introduces a thickness dimension to the rear portion of the body by forming a thickened portion that protrudes from the rear surface. This dimensional addition compensates for the height difference between front and rear portions, providing a flush mounting surface that eliminates misalignment during surface mounting while preserving the tapered shape needed for easy mold separation.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Ease of operation

If the vacuum picker attaches to the top surface of the side view LED package for transfer, then the package can be moved to the desired position, but the height difference between top surfaces of front and rear portions prevents level attachment

Engineering Contradiction:
Improveease of transferVSAvoidattachment levelness
Core Design Contradiction:
Ease of operationVSManufacturing precision

Solution Approach 1:

The thickened portion adds vertical thickness to the rear portion, creating a level top surface that aligns with the front portion. This dimensional modification provides a flat, level attachment surface for the vacuum picker, enabling proper grasping and level transfer of the LED package without the misalignment problems caused by the original height difference.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Productivity

If the front light emitting surface is misaligned with the side surface of the light guide plate, then the mounting process is simplified, but the light emitting efficiency is reduced

Engineering Contradiction:
Improvemounting speedVSAvoidlight emitting efficiency
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The thickened portion creates a flush mounting surface that extends the level interface to the mounting substrate. This dimensional feature ensures that when the package is mounted, the front light emitting surface automatically aligns with the side surface of the light guide plate, maintaining optimal light emitting efficiency while preserving simple mounting procedures.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS8129740B2Side view LED package and back light module comprising the same
Publication Date: 2012.03.06 SEOUL SEMICONDUCTOR
  • US8129740B2 patent drawing
  • US8129740B2 patent drawing
  • US8129740B2 patent drawing

AI summary

Disclosed is a side view LED package that can be more accurately mounted onto a surface of a substrate such as a printed circuit board without distortion includes a first portion of a body allowing light to be emitted in front thereof, the first portion having a horizontal plane formed on a top or bottom side thereof; and a second portion of the body positioned backward with respect to a back end boundary line of the first portion, the second portion being formed with an inclined plane that is adjacent to the horizontal plane and has height decreased from the back end boundary line, wherein the inclined plane is partially formed with an added thickness portion that is flush with the horizontal plane.