LED Package Recess in Folded Sheet Metal Heat Conductor
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Solution Overview
Problem
Conventional LED packages with heat conducting parts are complex and costly to produce, and existing lead frame structures are limited by the need for direct electrical connection between electric connecting parts and heat conducting parts, leading to assembly challenges and potential short circuits under external impact.
Innovation Solution
An LED package with a heat conducting part made of folded sheet metals featuring a recess to seat the LED chip, combined with a package body and transparent encapsulant to enhance reflection efficiency and simplify the manufacturing process, while ensuring electrical insulation and robustness against external impacts.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional heat conducting parts are used with direct electrical connection to lead frames, then electrical connection is achieved, but assembly complexity increases and short circuit risk occurs under external impact
Solution Approach 1:
The patent introduces an insulating structure as an intermediary component between the heat conducting part and the lead frame. This insulating structure prevents direct electrical contact while maintaining thermal conduction, thereby eliminating short circuit risks under external impact without significantly increasing assembly complexity. The insulating structure acts as a mediator that resolves the electrical connection conflict.
Solution Approach 2:
The patent segments the heat conducting part into multiple functional regions: a heat conduction region for thermal management and an insulating region for electrical isolation. This segmentation allows the same component to fulfill both thermal and electrical requirements simultaneously, reducing the need for additional separate components and simplifying the overall assembly process.
2Ease of manufacture
If conventional LED package structures are used, then basic functionality is achieved, but production cost increases due to multiple parts and components
Solution Approach 1:
The patent merges the heat conducting part and the insulating structure into a single integrated component. The insulating structure is formed as an integral part of the heat conducting part, eliminating the need for separate assembly steps and reducing the total number of parts. This merging significantly simplifies the manufacturing process and reduces production costs while maintaining both thermal conduction and electrical insulation functions.
Solution Approach 2:
The heat conducting part is designed to serve multiple functions simultaneously: it conducts heat from the LED chip, provides electrical insulation through its insulating region, and supports the LED chip through its recess structure. This multi-functionality reduces the need for additional specialized components, thereby lowering production costs and simplifying the overall package structure.
3Ease of manufacture
If folded sheet metals are used for heat conducting part, then manufacturing process is simplified, but structural precision must be maintained for proper LED chip seating
Solution Approach 1:
The patent incorporates the insulating structure and recess features into the heat conducting part during the initial forming process of the folded sheet metal. By performing the insulation and recess creation as preliminary actions during manufacturing, rather than as subsequent assembly steps, the process remains simple while ensuring precise positioning and dimensions of the recess for proper LED chip seating.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution simplifies the production process, enhances reflection efficiency, and provides a robust and insulated LED package structure that effectively manages heat and light emission, reducing production costs and improving reliability.
Implementation Method 1
the heat sink, i.e., the heat conducting part 14 is connected to a heat releasing substrate 32 of the circuit board 30 either through a heat conductive pad 36 or directly. This allows heat generated in the LED chip 12 to be mostly conducted through the heat conducting part 14 to the heat releasing substrate 32
Implementation Method 2
a heat conducting part comprised of folded sheet metals and a recess formed thereon to seat an LED chip therein, thereby enhancing reflection efficiency
Data Source
AI summary
The invention provides an LED package including an LED chip. In the LED package, a heat conducting part of folded sheet metals has a recess formed thereon to seat the LED chip therein. A package body houses the heat conducting part and directs light generated from the LED chip upward. Also, a transparent encapsulant is provided to at least the recess of the heat conducting part. Leads are partially housed by the package body to supply power to the LED chip. According to the invention, the sheet metals are folded to form the heat conducting part, and the recess is formed on the heat conducting part to seat the LED chip therein. This improves reflection efficiency and simplifies an overall process.