Light-Emitting Device Manufacturing with Recessed Resin Bonding
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Solution Overview
Problem
Existing methods for manufacturing light-emitting devices face challenges in enhancing light extraction efficiency and simplifying the manufacturing process, particularly in the handling and removal of substrates and wavelength conversion materials during the assembly of light-emitting elements.
Innovation Solution
A method involving the preparation of light-emitting elements with recessed surfaces, where a transmissive resin member with wavelength conversion material is applied between the light-emitting elements and a sheet member, allowing for easier substrate removal and improved light extraction by using a sheet member to cover lateral surfaces, thereby increasing the bonding strength and reducing damage during processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a light-emitting element is adhered to a support substrate and a phosphor layer is formed by spraying phosphor particles onto a semiconductor layer, then the light-emitting device can be manufactured, but the light extraction efficiency is insufficient and the manufacturing process is complex
Solution Approach 1:
The patent applies preliminary action by pre-forming recesses on the light-emitting surface of the semiconductor layer before adhering the wavelength conversion material. This preliminary structural preparation allows the wavelength conversion material to be positioned precisely in the recesses, improving light extraction efficiency while simplifying the overall manufacturing process by combining multiple functions into one preparatory step
Solution Approach 2:
The patent uses a transparent resin as an intermediary material that fills the recesses and bonds the wavelength conversion material to the semiconductor layer. This intermediary material serves dual purposes: it facilitates easy removal of the support substrate while maintaining strong bonding between components, and it improves light extraction by reducing total internal reflection at the interfaces
2Reliability
If the support substrate is removed after adhering the light-emitting element, then the light extraction efficiency can be improved, but the wavelength conversion material may be damaged during substrate removal
Solution Approach 1:
The patent applies beforehand cushioning by filling the recesses with a transparent resin that acts as a cushioning material. This resin protects the wavelength conversion material during support substrate removal by distributing mechanical stresses and preventing direct contact between the brittle wavelength conversion material and the removal process, thereby preventing damage while maintaining light extraction efficiency
3Ease of manufacture
If the wavelength conversion material is directly applied on the semiconductor layer, then the manufacturing process is simple, but the bonding strength is insufficient and damage occurs during processing
Solution Approach 1:
The patent applies local quality by creating recesses with specific geometries on the semiconductor layer surface and filling them with transparent resin. This local structural modification concentrates the bonding interface in the recess regions, significantly improving bonding strength at critical locations while maintaining overall manufacturing simplicity. The recesses provide mechanical interlocking that enhances bonding without requiring complex overall restructuring
4Reliability
If total internal reflections are reduced to improve light extraction, then the light extraction efficiency increases, but the manufacturing precision requirements increase
Solution Approach 1:
The patent applies parameter changes by optimizing the depth, width, and shape parameters of the recesses to achieve effective light extraction improvement. By carefully controlling these geometric parameters within specific ranges, the design reduces total internal reflection sufficiently to improve light extraction efficiency while keeping the manufacturing precision requirements at achievable levels through conventional fabrication techniques
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances light extraction efficiency by reducing total internal reflections and simplifies the manufacturing process, increasing yield and bonding strength while minimizing damage to light-emitting elements and wavelength conversion materials.
Implementation Method 1
The first member includes an uncured resin member that is transmissive. The method includes curing the first member
Implementation Method 2
The sheet member is adhesive. The method includes disposing the plurality of light-emitting elements on a sheet member so that the second surfaces of the plurality of light-emitting elements face the sheet member
Implementation Method 3
The second member includes a wavelength conversion material and has a higher hardness than the uncured resin member
Data Source
AI summary
A method for manufacturing a light-emitting device includes preparing light-emitting elements, each including a semiconductor structure body that includes a first surface including recesses, a second surface, and a lateral surface. The method includes disposing the light-emitting elements on an adhesive sheet member so that the second surfaces face the sheet member and the lateral surfaces are covered with the sheet member. The method includes causing a first member to contact the first surfaces so that the first member is located inside the recesses and located between the sheet member and a second member in a state in which the second member is located on the first member. The first member includes a transmissive uncured resin member. The second member includes a wavelength conversion material and has a higher hardness than the uncured resin member. The method includes curing the first member, and removing the sheet member.