Light Emitting Device Recessed Cavity for Wire Bonding
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Solution Overview
Problem
Conventional light emitting devices face challenges in efficiently mounting large area light emitting chips and ensuring reliable bonding of wires, which affects optical efficiency and reliability.
Innovation Solution
A light emitting device with a novel cavity structure featuring a recess region on one inner side of the cavity, allowing for easy wire bonding and accommodating larger light emitting chips, while enhancing optical efficiency and reliability by optimizing the lead frame and molding member design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a conventional cavity structure is used, then the device structure is simple, but it is difficult to mount large area light emitting chips and ensure reliable wire bonding
Solution Approach 1:
The cavity structure is segmented into multiple functional regions: a mounting region with a first recess for securing the light emitting chip, a wire bonding region with a second recess for facilitating wire attachment, and a lead frame region. This segmentation allows each region to be optimized for its specific function, enabling large area chip mounting and reliable wire bonding while maintaining overall structural organization
Solution Approach 2:
Different regions of the cavity are given different local qualities through varying recess depths and configurations. The first recess has a specific depth optimized for chip mounting, while the second recess has different dimensions optimized for wire bonding. This local differentiation allows each area to perform its function effectively without requiring the entire cavity to be complex
2Reliability
If wire bonding is performed in a conventional cavity, then the bonding process is simple, but wire bonding reliability is poor
Solution Approach 1:
The second recess is pre-formed in the cavity structure before wire bonding occurs. This preliminary structural preparation provides an optimized bonding surface and geometry, ensuring that when wire bonding is performed, the process is facilitated by the pre-configured recess, thereby improving reliability without significantly complicating the manufacturing process
3Area of moving object
If the cavity is designed to accommodate large chips, then chip mounting capability is improved, but the device dimensions increase
Solution Approach 1:
The first recess for chip mounting is nested within the cavity structure, allowing the light emitting chip to be securely positioned in a dedicated space. The second recess for wire bonding is also nested within the cavity, positioned adjacent to the first recess. This nested arrangement allows large area chips to be accommodated while maintaining a compact overall device footprint, as the recesses utilize the vertical and lateral space efficiently within the existing cavity boundaries
Data Source
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AI summary
Disclosed is a light emitting device. The light emitting device includes: a body including a cavity having first and second inner sides opposite to each other and third and fourth inner sides connected to first and second inner sides and opposite to each other; a first lead frame extending from a bottom of cavity under a first inner side of cavity; a second lead frame extending from the bottom of cavity under a second inner side of cavity; a gap part in the bottom of cavity between first and second lead frames; a light emitting chip on first lead frame; a protective chip on the second lead frame; a recess region recessed outward of body from at least one of third and fourth inner sides of cavity; and a first wire connected to the second frame disposed between light emitting chip and a sidewall of the recess region, wherein the first lead frame includes a first recess portion recessed from the gap part and a second recess portion recessed from an outer surface of the body and the first recess portion has a depth different from a depth of the second recess portion.