LED Light Emitting Device With Recessed Substrate
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Solution Overview
Problem
Existing light-emitting diodes (LEDs) face challenges in achieving uniform light distribution, which is crucial for high-quality lighting applications as they become more prevalent in various devices.
Innovation Solution
A light-emitting device is designed with a thermal conductive and transparent substrate featuring recesses for LEDs, a wavelength converting layer, and an electrically conductive structure, allowing for improved stability and uniform light emission by arranging LEDs in recesses with a specific distance and using wavelength converting materials to emit white light through multiple surfaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If LEDs are connected to components to form a light emitting apparatus, then the LED can be disposed on a submount and carrier, but the light distribution uniformity deteriorates
Solution Approach 1:
The patent applies local quality by creating recesses at specific locations on the substrate where LEDs are mounted. These recesses are strategically positioned to control light emission patterns and achieve uniform light distribution across the illumination area, while maintaining stable LED connections to the substrate.
2Reliability
If a solder or adhesive is formed between LEDs and carrier, then electrical and mechanical connection is achieved, but heat dissipation efficiency deteriorates
Solution Approach 1:
The patent employs composite materials by combining a transparent substrate with high thermal conductivity properties. This substrate integrates both mechanical support functions (replacing traditional solder/adhesive connections) and heat dissipation functions, while maintaining electrical isolation and optical transparency for uniform light emission.
3Ease of manufacture
If traditional LED mounting methods are used, then assembly is simplified, but heat dissipation and light uniformity deteriorate
Solution Approach 1:
The patent implements multi-functionality by designing a single transparent substrate that simultaneously serves as the mounting carrier for LEDs, the heat dissipation pathway, and the optical medium for uniform light distribution. This eliminates the need for separate submounts, carriers, and thermal management components, simplifying assembly while improving heat dissipation and light uniformity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances light distribution and stability, enabling efficient heat dissipation and uniform light emission, making it suitable for future mainstream lighting applications.
Implementation Method 1
a wavelength converting layer covering the recess and the upper surface of the substrate
Implementation Method 2
the substrate is thermal conductive and transparent
Data Source
AI summary
This disclosure discloses a light-emitting device. The light-emitting device includes a transparent substrate with a recess and an upper surface; a wavelength converting layer covering the recess and the upper surface of the transparent substrate; and a light-emitting diode arranged in the recess and over the wavelength converting layer.