LED Package Reflective Sidewall for Heat and Light Management
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Solution Overview
Problem
Light-emitting diodes (LEDs) face challenges in wavelength conversion efficiency due to incomplete coverage of the wavelength conversion material, leading to decreased light transmission and heat dissipation issues, as well as non-uniform thickness causing uneven light absorption.
Innovation Solution
A semiconductor luminescence device with a transparent paste layer and a reflective wall, where the wavelength conversion structure is arranged on the upper surface, and the epitaxial structure has a side surface devoid of the transparent layer and wavelength conversion structure, enhancing light extraction efficiency while minimizing heat dissipation problems.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the wavelength conversion material covers the LED chip completely, then the wavelength conversion efficiency is enhanced, but it causes heat dissipation problems
Solution Approach 1:
The patent divides the wavelength conversion material into two distinct structures: a first wavelength conversion material layer covering the active region, and a second wavelength conversion material layer (reflective wall) covering the sidewall. This segmentation allows the light to undergo wavelength conversion twice - once in the first layer and again after reflection from the second layer - thereby enhancing conversion efficiency while distributing heat generation across separate structural zones rather than concentrating it over the entire chip surface.
2Temperature
If the wavelength conversion material does not cover where the light emits from the LED chip completely, then heat dissipation is improved, but the wavelength conversion efficiency is decreased
Solution Approach 1:
The patent extends the wavelength conversion function from a single planar layer to a three-dimensional configuration by adding a sidewall layer. Light emitted from the LED chip travels through the first wavelength conversion material layer, then reflects off the sidewall structure, passing through the conversion material again. This dimensional extension ensures complete coverage of light emission paths while maintaining heat dissipation benefits through structural separation.
3Ease of manufacture
If the thickness of the wavelength conversion material is not uniform, then manufacturing is easier, but the light absorption becomes uneven
Solution Approach 1:
The patent divides the wavelength conversion system into multiple discrete layers with potentially different thickness characteristics. The first layer can be applied with standard spreading techniques, and the second sidewall layer can be formed separately. This segmentation allows each layer to be optimized independently - the first layer for ease of manufacture and the second layer for optical performance - thereby resolving the contradiction between manufacturing ease and light absorption uniformity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution maintains high light extraction efficiency with minimal light loss, allowing for uniform wavelength conversion and improved heat dissipation by using a transparent paste layer with a reflective wall to direct light and manage heat effectively.
Implementation Method 1
The material of the wavelength conversion can excite the yellow light, green light, or red light when it is irradiated by the blue light emitted from the LED chip
Implementation Method 2
a reflective wall arranged to cover the sidewall
Implementation Method 3
a transparent paste layer with a reflective wall to direct light and manage heat effectively
Data Source
AI summary
The present application discloses a light-emitting semiconductor device including a transparent layer having an upper surface, a lower surface, and a sidewall; a wavelength conversion structure arranged on the upper surface; an epitaxial structure arranged on the lower surface and having a side surface devoid of the transparent layer and the wavelength conversion structure; and a reflective wall arranged to cover the sidewall.