LED Chip Package Reflector Layer Light Efficiency
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Solution Overview
Problem
Conventional LED chip packages suffer from reduced light emitting efficiency due to the excited light being absorbed back into the LED chip, causing overheating and phosphor deterioration, and the wavelength conversion light being lost through reflection or absorption within the package.
Innovation Solution
Incorporating a reflector layer between the LED chip and the phosphor layer with a refractive index matching the reflector resin, which reflects the wavelength conversion light and prevents its absorption by the LED chip, enhancing light transmission and emission efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If phosphors are concentrated on the LED chip, then the LED chip package can easily obtain excited light and wavelength conversion light, but the wavelength conversion light returns to the LED chip to be absorbed, increasing temperature and deteriorating the LED chip
Solution Approach 1:
The patent extracts the phosphor layer from direct contact with the LED chip by introducing a transparent resin layer as an intermediate medium. This separation prevents the wavelength conversion light from returning to and being absorbed by the LED chip, thereby reducing temperature increase and improving reliability while maintaining light emission efficiency.
Solution Approach 2:
The transparent resin layer acts as an intermediary between the LED chip and phosphor layer. It allows excited light to pass through to the phosphor while preventing wavelength conversion light from returning to the LED chip, thus mediating the interaction between these components to resolve the contradiction.
2Use of energy by moving object
If phosphors are concentrated on the LED chip, then wavelength conversion light is easily obtained, but the transmission path becomes long making emission disadvantageous
Solution Approach 1:
The patent extracts the phosphor layer from direct contact with the LED chip and positions it at a distance through the transparent resin layer. This creates an optimized transmission path that is long enough to prevent light return absorption but short enough to maintain efficient light emission.
3Length of moving object
If phosphors are uniformly scattered in transparent resin layer, then transmission path is short for easy emission, but excited light may be reflected before phosphors absorb it
Solution Approach 1:
The patent applies local quality by creating different optical properties in different regions. The transparent resin layer has optical properties optimized for transmitting excited light to the phosphor, while the phosphor layer has properties optimized for absorbing excited light and emitting wavelength conversion light. This localized optimization resolves the contradiction between transmission path length and absorption efficiency.
4Illumination intensity
If excited light and wavelength conversion light are transmitted inside package body, then light can be emitted outside, but light may be continuously reflected and transmitted to be exhausted or absorbed into LED chip
Solution Approach 1:
The patent converts the harmful effect of light reflection and return absorption into a beneficial outcome. By carefully designing the transparent resin layer thickness and optical properties, the reflected light is redirected to contribute to overall light emission rather than being lost, thus converting potential energy loss into useful light output.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration increases the overall light emitting efficiency by preventing the absorption of wavelength conversion light and reducing heat buildup, leading to improved reliability and longer LED chip lifespan.
Implementation Method 1
a phosphor absorbing the excited light and emitting a wavelength conversion light obtained by converting a wavelength of the excited light
Implementation Method 2
a reflector layer including a reflector formed between the LED chip and the phosphor layer, transmitting the excited light to the phosphor layer, and reflecting the wavelength conversion light from the phosphor layer
Data Source
AI summary
A light emitting diode (LED) chip package including: a package body; an LED chip mounted on the package body and emitting an excited light; a phosphor layer including a phosphor absorbing the excited light and emitting a wavelength conversion light obtained by converting a wavelength of the excited light and a phosphor resin mixed with the phosphor; and a reflector layer including a reflector formed between the LED chip and the phosphor layer, transmitting the excited light to the phosphor layer, and reflecting the wavelength conversion light from the phosphor layer, and a reflector resin mixed with the reflector.