Light Emitting Device Resin Covering Segmentation
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Solution Overview
Problem
Existing light emitting devices face issues with increased electrical resistance and separation of the resin covering portion due to elongated through holes and uneven stress distribution caused by thermal expansion, leading to poor adhesion between the resin and the substrate.
Innovation Solution
A light emitting device with a ridge-shaped resin covering portion that includes first and second outer edge portions bonded to the substrate within the through holes, distributing high-strength and low-strength bonding areas to prevent separation and reduce electrical resistance, while allowing arbitrary width adjustment of the resin covering portion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the width of the resin-covered part is increased, then the coverage area of the electrode pattern is improved, but the electrical resistance of the electrode patterns increases due to elongated through holes
Solution Approach 1:
The through holes are segmented into two distinct arrays: first through holes arranged along the first outer edge portion and second through holes arranged along the second outer edge portion. This segmentation allows the resin covering portion to be divided into two bonded regions, enabling independent optimization of each region's function. The first through holes provide bonding strength while the second through holes provide electrical connection, resolving the contradiction between coverage area and electrical resistance.
Solution Approach 2:
Different regions of the resin covering portion are assigned different functions: the first outer edge portion with first through holes is optimized for mechanical bonding to the substrate, while the second outer edge portion with second through holes is optimized for electrical connection to the electrode pattern. This local differentiation allows the resin covering portion to simultaneously achieve wide coverage and low electrical resistance by optimizing each region for its specific purpose.
2Ease of manufacture
If through holes are arranged at equal intervals, then the manufacturing process is simplified, but the stress distribution becomes uneven causing separation at low-strength portions
Solution Approach 1:
The through holes are segmented into two functional arrays positioned at different locations along the resin covering portion. The first through holes are positioned to provide mechanical bonding support, while the second through holes are positioned to provide electrical connection. This segmentation creates multiple high-strength bonding portions distributed along the resin covering portion, preventing stress concentration and separation while maintaining manufacturing simplicity.
Solution Approach 2:
The first and second through holes are asymmetrically arranged at different positions along the resin covering portion rather than being uniformly distributed. The first through holes are positioned along the first outer edge portion while the second through holes are positioned along the second outer edge portion, creating asymmetric stress distribution that enhances overall bonding reliability and prevents separation at specific low-strength portions.
3Ease of manufacture
If through holes are placed only on one side portion, then the manufacturing process is simplified, but the stress balance is lost causing separation
Solution Approach 1:
The first and second through holes are asymmetrically positioned at different outer edge portions of the resin covering portion. This asymmetric arrangement creates balanced stress distribution across the entire resin covering portion by positioning bonding points at both ends, preventing stress concentration and maintaining structural stability under thermal expansion while keeping the manufacturing process simple.
Solution Approach 2:
The through holes are arranged in two different spatial dimensions along the resin covering portion: first through holes along the first outer edge portion and second through holes along the second outer edge portion. This two-dimensional arrangement provides stress balance across the width of the resin covering portion, preventing separation while maintaining manufacturing simplicity through systematic positioning.
4Strength
If the resin covering portion is bonded to the substrate, then the adhesion strength is improved, but the thermal expansion stress causes separation at weak bonding portions
Solution Approach 1:
The bonding between the resin covering portion and substrate is segmented into multiple discrete bonding points through the first and second through holes. These distributed bonding points share the thermal expansion stress, preventing concentration of stress at any single location. The resin covering portion is bonded to the substrate at multiple locations along its length, enhancing bonding stability under thermal stress while maintaining strong adhesion.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents separation of the resin covering portion and suppresses the increase in electrical resistance, allowing for greater design flexibility and reliable bonding even under thermal stress.
Implementation Method 1
the stress generated by the thermal expansion of the resin-covered part is concentrated on the low-strength portions
Data Source
AI summary
A light emitting device includes: a substrate; an electrode pattern formed on the substrate; a light emitting element connected to the electrode pattern; a ridge-shaped resin covering portion which covers a part of the electrode pattern, and which includes a first and second outer edge portions; first and second through holes formed to penetrate through the electrode pattern such that the substrate is exposed; and first and second hole arrays including the first and second through holes arranged along the first and second outer edge portions, respectively. The first and second outer edge portions cover at least a part of the first and second through holes, respectively, and are bonded to the substrate in the first and second through holes, respectively.