LED Resin Package Depression Enhances Encapsulant Adhesion
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Solution Overview
Problem
Delamination between the wavelength conversion layer and the partition in LED devices degrades the reliability of the light-emitting diodes, leading to reduced light extraction efficiency and device performance.
Innovation Solution
A light-emitting device design featuring a resin package with a recess containing a light-reflective member and an encapsulant, where the second resin portion has depressions on its surface to increase the contact area with the encapsulant, enhancing adhesion and preventing delamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a partition is formed inside the recess to prevent composition adhesion, then the reflective layer can be properly formed, but delamination occurs between the wavelength conversion layer and the partition
Solution Approach 1:
The patent applies preliminary action by forming protrusions on the partition before applying the wavelength conversion layer. These protrusions are created in advance to prevent delamination, rather than attempting to fix the adhesion problem after the layers are already bonded. The protrusions are formed by injecting a resin composition into grooves on the partition surface before the wavelength conversion layer is applied, creating mechanical interlocking features that prevent future delamination.
Solution Approach 2:
The patent utilizes porous materials by creating a grooved surface structure on the partition that resembles a porous configuration. These grooves and subsequent protrusions increase the surface area and create mechanical interlocking points that enhance adhesion. The resin composition fills these grooves to form protrusions that physically anchor the wavelength conversion layer to the partition, preventing delamination while maintaining the partition's primary functions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design improves the reliability and light extraction efficiency of the LED device by ensuring a strong bond between the encapsulant and the resin portion, reducing the likelihood of delamination and enhancing overall performance.
Implementation Method 1
a light-reflective member being located between the inner side-wall surface and the second resin portion inside the recess
Implementation Method 2
an encapsulant located in a region of the recess that is surrounded by the light-reflective member, the encapsulant covering the second resin portion and the light-emitting element
Implementation Method 3
The second resin portion has a depression on a surface thereof. A part of the encapsulant is located inside the depression of the second resin portion
Data Source
AI summary
A light emitting device includes: a light-emitting element; a resin package including a plurality of leads including first and second leads, a first resin portion, a second resin portion extending around an element mounting region, and a third resin portion, wherein the plurality of leads and the first resin portion define a recess having an inner side-wall surface; a light-reflective member being located between the inner side-wall surface and the second resin portion inside the recess; and an encapsulant located in a region of the recess that is surrounded by the light-reflective member, the encapsulant covering the second resin portion and the light-emitting element. The second resin portion has a depression in a surface thereof. A part of the encapsulant is located inside the depression of the second resin portion.