LED Resin Embedding Process for Precise Chip Alignment
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Solution Overview
Problem
There is a demand for cost-effective manufacturing methods for light emitting devices that include light emitting elements, as existing methods may not efficiently produce devices with resin-covered lateral surfaces while maintaining alignment and preventing misalignment or obliqueness of the semiconductor stack structures.
Innovation Solution
A method involving a resin layer disposition step, light emitting element mounting, load application to embed the semiconductor stack structure partly in the resin layer while exposing the second surface, a first heating step to lower viscosity, and a second heating step to harden the resin, ensuring the lateral surfaces are covered by a resin member, is employed.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a conventional manufacturing method is used, then the manufacturing cost is reduced, but the alignment precision and prevention of misalignment of semiconductor stack structures deteriorates
Solution Approach 1:
The resin layer is prepared in an A-stage (partially cured) state before mounting the light emitting element, allowing the semiconductor stack structure to be embedded at the desired position and orientation. This preliminary preparation of the resin layer enables precise alignment control during the embedding process, while the A-stage state facilitates easy manipulation and cost-effective manufacturing.
Solution Approach 2:
The resin layer's curing state is changed from A-stage (partially cured, flexible) to fully cured (hardened) after embedding. This parameter change allows the resin to transition from a state suitable for precise positioning and embedding to a state that provides structural stability and prevents misalignment, thereby achieving both manufacturing precision and ease of manufacture.
2Stability of the object's composition
If the resin layer is heated to harden, then the structural stability is improved, but the viscosity reduction and embedding ease deteriorates
Solution Approach 1:
The heating process is divided into two distinct stages: first, the resin layer is heated to reduce viscosity and facilitate embedding of the semiconductor stack structure; second, the resin layer is heated again at a higher temperature to harden and provide structural stability. This periodic heating action allows the resin to exhibit different physical properties at different times, achieving both embedding ease and structural stability.
Solution Approach 2:
The resin layer undergoes phase transitions between different curing states (A-stage to fully cured) through controlled heating. The first heating stage transitions the resin to a lower viscosity state for easy embedding, while the second heating stage transitions it to a hardened state for structural stability, utilizing phase transition principles to resolve the contradiction.
3Shape
If the semiconductor stack structure is embedded in the resin layer, then the lateral surface coverage is improved, but the exposure of the second surface and alignment control deteriorates
Solution Approach 1:
The resin layer is prepared in an A-stage state before embedding, allowing the semiconductor stack structure to be positioned and embedded with precise alignment control. The A-stage resin's flexibility enables accurate positioning while the embedding process ensures complete lateral surface coverage, and the subsequent hardening locks in the precise alignment.
Solution Approach 2:
The resin layer exhibits different properties at different stages: in the A-stage, it provides flexibility for alignment control; after hardening, it provides structural stability while maintaining the embedded position. This local quality change through curing stages allows both precise alignment control and complete lateral surface coverage to be achieved.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method allows for the inexpensive and accurate manufacturing of light emitting devices with resin-covered lateral surfaces, preventing misalignment and improving product yield by embedding the semiconductor stack structures in the resin while exposing the second surface.
Implementation Method 1
a first heating step including heating the resin layer at a first temperature without applying the load to the light emitting element to lower the viscosity of the resin layer
Implementation Method 2
a second heating step including heating the resin layer at a second temperature higher than the first temperature to harden in the state in which the second surface is exposed from the resin layer to form a resin member
Data Source
AI summary
A method of manufacturing a light emitting device includes: a resin layer disposition step including disposing, on a support, a resin layer in an A-stage state; a light emitting element mounting step including mounting a light emitting element on the resin layer such that a first surface faces an upper surface of the resin layer; a load application step including applying a load to the light emitting element so as to embed the semiconductor stack structure at least partly in the resin layer while a second surface of the light emitting element is exposed from the resin layer; a first heating step including heating the resin layer at a first temperature without applying the load, to lower a viscosity of the resin layer; and a second heating step including heating the resin layer at a second temperature higher than the first temperature to harden the resin layer.