Resin Frame Reinforcement for LED Mounting Load
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Solution Overview
Problem
In Chip-On-Board light-emitting devices, the resin frame used for sealing can deform or break under mounting load due to its soft nature, potentially damaging embedded wires, which is a challenge in achieving high-density mounting of light-emitting elements.
Innovation Solution
A light-emitting device design featuring a planar lead frame with insulating resin and metal portions, where a first resin frame with moderate Shore A hardness (30-50) encloses light-emitting elements and a second, harder resin frame (Shore D hardness 30-90) covers the outer surface, providing structural reinforcement to prevent deformation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a soft resin frame is used to prevent wire deformation, then wire protection is improved, but resistance to mounting load deteriorates
Solution Approach 1:
The patent uses a composite resin frame structure combining a soft first resin frame (Shore A 30-50) for wire protection and a hard second resin frame (Shore D 30-90) for mounting load resistance. This composite approach allows each layer to fulfill its specific function: the soft inner layer cushions wires while the hard outer layer provides structural strength during mounting.
2Productivity
If multiple light-emitting elements are mounted at high density, then light output is improved, but risk of wire breakage increases
Solution Approach 1:
The soft first resin frame is positioned beforehand to surround and cushion the wires before mounting operations. This prior cushioning protects wires from breakage during subsequent high-density element mounting and handling, allowing higher productivity without sacrificing wire integrity.
3Strength
If the resin frame is made harder to resist mounting load, then structural strength is improved, but wire protection deteriorates
Solution Approach 1:
The resin frame is segmented into two distinct layers: a soft first resin frame (Shore A 30-50) that directly contacts and protects wires, and a hard second resin frame (Shore D 30-90) that provides mounting load resistance. This segmentation allows each layer to optimize its properties for its specific function without compromise.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances the resilience of the resin frame, reducing the likelihood of deformation and wire damage during mounting, allowing for higher density and reliability in light-emitting element placement.
Implementation Method 1
a sealing resin containing a phosphor for converting the wavelength of light emitted from the light-emitting elements
Data Source
Figure 1
Figure 2(A)~2(D)
Figure 3(A)~3(B)
AI summary
Provided is a light-emitting device of which a resin frame serving as a dam of a sealing resin is not readily deformed. The light-emitting device includes: a planar lead frame configured from first and second metal portions which are spaced apart from each other with an insulating resin interposed therebetween; light-emitting elements mounted on the first metal portion and electrically connected by wires to the first and second metal portions; a first resin frame disposed on the lead frame so as to enclose the light-emitting elements; a sealing resin containing a phosphor for converting the wavelength of light emitted from the light-emitting elements, the sealing resin being filled into a region on the lead frame enclosed by the first resin frame to seal the light-emitting elements; and a second resin frame being harder than the first resin frame and covering an outer surface of the first resin frame at an outer edge of the lead frame.