LED Sealing Resin Injection with Air Vent for Chromaticity Stability
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Solution Overview
Problem
Existing light emitting apparatuses using LED chips face challenges in stabilizing chromaticity, strength, and heat resistance due to variations in sealing resin quantity and quality, as well as mechanical and environmental influences, leading to issues with color stability, adhesion, and heat management.
Innovation Solution
A light emitting apparatus design featuring a substrate with a light-transmitting member having a concave portion and resin-injection inlet, along with an air vent, filled with a resin containing chromaticity-adjusting members, which ensures consistent resin quantity and reduces mechanical stress on bonding wires, while the light-transmitting member provides structural support and heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If machine-controlled injection of sealing resin is used, then production efficiency is improved, but chromaticity stability deteriorates due to variations in resin quantity
Solution Approach 1:
The patent pre-forms the sealing resin with phosphors mixed in a specific ratio before injection. This preliminary preparation ensures that the resin-phosphor mixture has consistent composition and volume, allowing machine-controlled injection to deliver precise amounts without variation. The pre-mixing step guarantees that each injection contains the exact required quantity of phosphors and resin, thereby maintaining chromaticity stability while enabling efficient automated production.
2Strength
If high hardness sealing resin is used, then mechanical strength is improved, but reliability deteriorates due to bonding wire damage
Solution Approach 1:
The patent adjusts the hardness parameter of the sealing resin to an optimal range that balances mechanical strength and wire protection. By controlling the resin's physical properties through formulation and curing parameters, the invention achieves sufficient structural support without excessive hardness that would damage bonding wires. This parameter optimization allows the resin to be tough rather than hard, providing protection while maintaining reliability.
3Ease of manufacture
If conventional sealing resin is used, then ease of manufacture is improved, but heat resistance deteriorates due to poor heat dissipation
Solution Approach 1:
The patent creates a composite sealing resin system by mixing base resin with phosphors in specific proportions. This composite structure combines the adhesive and sealing properties of the resin with the thermal management characteristics of the phosphor particles. The phosphors act as heat sinks, conducting heat away from the LED chip while the resin provides structural sealing. This composite approach maintains ease of manufacture through simple mixing while dramatically improving heat dissipation capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design achieves stable chromaticity, enhanced strength, and improved heat resistance, reducing the influence of external forces and production costs, while maintaining high reliability and efficiency in light emission.
Implementation Method 1
improved heat resistance, reducing the influence of external forces and production costs
Data Source
AI summary
A light emitting apparatus including a substrate, at least one light emitting diode chip mounted on the substrate, a light-transmitting member disposed on the substrate to form a space between the light-transmitting member and the substrate, and a resin disposed in the space to seal the light emitting diode chip, the light-transmitting member including at least one resin-injection inlet and at least one air vent, the space being filled with the resin injected into the space through the resin-injection inlet.