LED Encapsulation via Patterned Resin Laminate
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Solution Overview
Problem
The existing methods for producing light emitting diode (LED) devices require complex positioning and pressing processes due to the need for precise alignment of a metal mold die with the LED, complicating the encapsulation process.
Innovation Solution
A method involving a laminate with a supporting layer, a constraining layer, and an encapsulating resin layer, where the resin layer is cut into patterns corresponding to the LED element, allowing for accurate encapsulation without the need for precise metal mold die positioning, using a thermosetting resin and optionally including a phosphor layer for enhanced performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a metal mold die with a concave portion is pressed onto the board to encapsulate the LED, then the resin layer can be formed into a shape corresponding to the concave portion, but the metal mold die requires accurate positioning with respect to the LED which complicates the production process
Solution Approach 1:
The resin layer is pre-formed on the board before LED mounting. The pre-formed resin layer includes a resin portion that will later encapsulate the LED, eliminating the need for precise positioning of a metal mold die during the encapsulation process. This preliminary formation of the resin layer simplifies the overall production process while maintaining encapsulation accuracy.
2Ease of manufacture
If the resin layer is pre-formed on the board, then the metal mold die positioning can be omitted, but the resin layer must be accurately formed into a pattern corresponding to the LED
Solution Approach 1:
The resin layer is formed in a semi-cured state (B-stage) rather than fully cured. This parameter change in the curing state allows the resin to be molded into the desired pattern corresponding to the LED position before final curing. The semi-cured state provides sufficient workability for accurate pattern formation while maintaining the structural integrity needed for precise positioning.
3Reliability
If the resin layer is pressed onto the LED, then encapsulation is achieved, but the resin layer shape must be maintained during pressing
Solution Approach 1:
The resin layer is cured in stages: first to a B-stage (semi-cured) state for molding and positioning, then to a fully cured state for final encapsulation. This staged curing process maintains shape stability during pressing while achieving reliable encapsulation. The B-stage provides enough rigidity to maintain shape during the pressing operation while still allowing for proper encapsulation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the encapsulation process, ensuring accurate pattern cutting and shape maintenance of the resin layer, resulting in a reliable and efficiently produced LED device with improved encapsulation accuracy and reliability.
Implementation Method 1
the encapsulating resin is a thermosetting resin and the encapsulating resin layer is formed of a B-stage resin of the thermosetting resin
Data Source
AI summary
A method for producing a light emitting diode device includes the steps of preparing a laminate including, in order, a supporting layer, a constraining layer and an encapsulating resin layer, each formed in a thickness direction; cutting the encapsulating resin layer and the constraining layer in the laminate into a pattern corresponding to the light emitting diode element; removing a portion which does not correspond to the light emitting diode element in the encapsulating resin layer and the constraining layer that are cut into the pattern; allowing the encapsulating resin layer corresponding to the light emitting diode element to be opposed to the light emitting diode element to be pressed in the direction where they come close to each other so as to encapsulate the light emitting diode element by the encapsulating resin layer; and removing the supporting layer and the constraining layer from the laminate.