Light Emitting Device Resin Layer Alignment
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Solution Overview
Problem
Self-alignment issues arise in chip size package (CSP) light emitting devices due to the type and condition of the mounting substrate and joint material, affecting the mounting and performance of the light emitting device.
Innovation Solution
A light emitting device design featuring a semiconductor laminated body with exposed electrodes and a resin layer that covers the side surface, with the resin layer's upper surface positioned lower than the semiconductor laminated body's upper surface, preventing self-alignment problems by ensuring proper alignment and reducing light leakage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the resin layer covers the side surface of the light emitting element, then light leakage is reduced and self-alignment problems are prevented, but the upper surface of the resin layer being lower than the semiconductor laminated body may affect mounting flexibility
Solution Approach 1:
The resin layer is applied selectively to cover only the side surface of the light emitting element, with its upper surface positioned lower than the semiconductor laminated body. This localized application provides light leakage prevention and alignment stability where needed, while leaving the top surface accessible for mounting operations, thus resolving the contradiction between reliability improvement and mounting flexibility.
2Illumination intensity
If the upper surface of the resin layer is lower than the upper surface of the semiconductor laminated body, then light extraction efficiency is maintained, but mounting on substrates with warpage becomes more difficult
Solution Approach 1:
The resin layer covers the side surface partially, with its upper surface positioned lower than the semiconductor laminated body. This partial coverage is sufficient to prevent light leakage and maintain extraction efficiency, while the exposed portion of the semiconductor laminated body provides tolerance for mounting on substrates with warpage, thus resolving the contradiction between light extraction efficiency and manufacturing ease.
Data Source
AI summary
A semiconductor device has a light emitting element, and a resin layer; the light emitting element includes a semiconductor laminated body in which a first semiconductor layer and a second semiconductor layer are laminated in sequence, a second electrode connected to the second semiconductor layer on an upper surface of the second semiconductor layer that forms an upper surface of the semiconductor laminated body, and a first electrode connected to the first semiconductor layer on an upper surface of the first semiconductor layer in which a portion of the second semiconductor layer on one surface of the semiconductor laminated body is removed and a portion of the first semiconductor layer is exposed; and the resin layer is configured to cover at least a side surface of the light emitting element, and an upper surface of the resin layer is lower than the upper surface of the semiconductor laminated body.