Light Emitting Device Resin Package Mechanical Strength
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Solution Overview
Problem
Existing light emitting devices face challenges in achieving a compact and high-strength package design while reducing thickness, particularly in side-view type configurations, which affects the mechanical integrity and light extraction efficiency.
Innovation Solution
A light emitting device design featuring a resin molded package with strategically positioned and bent leads, including a first and second lead with projecting portions, and resin regions to enhance mechanical strength and light reflectance, allowing for reduced thickness without compromising structural integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the package thickness is reduced to achieve a compact light emitting device, then the device size and weight are reduced, but the mechanical strength and structural integrity of the package deteriorate
Solution Approach 1:
The lead structure is segmented into multiple portions (first bottom portion, first side portion, second side portion, third side portion, fourth side portion) with projecting portions that create distinct resin regions. This segmentation allows the resin to form localized reinforcement zones that strengthen the package structure without increasing overall thickness.
Solution Approach 2:
The resin molded body exhibits local quality variations through the formation of first, second, and third resin regions with different densities and mechanical properties. These localized resin regions are positioned strategically to provide enhanced strength where needed while maintaining thin overall package thickness in non-critical areas.
2Volume of moving object
If the package thickness is reduced to achieve a compact light emitting device, then the device size and weight are reduced, but the light extraction efficiency deteriorates
Solution Approach 1:
The resin molded body exhibits local quality variations through the formation of first, second, and third resin regions with different densities and mechanical properties. These localized resin regions are positioned strategically to provide enhanced strength where needed while maintaining thin overall package thickness in non-critical areas.
Solution Approach 2:
The lead structure utilizes three-dimensional positioning with projecting portions that extend in multiple directions (first side portion in first wall portion, second side portion in second wall portion, third side portion and fourth side portion providing additional spatial distribution). This spatial arrangement creates effective light extraction pathways without increasing package thickness.
3Ease of manufacture
If the lead structure is simplified to reduce manufacturing complexity, then the manufacturing process becomes easier, but the mechanical strength and light extraction efficiency deteriorate
Solution Approach 1:
The lead structure is pre-formed with specific projecting portions (first projecting portion, second projecting portion) and multiple side portions during the molding process. This preliminary formation of the complex lead geometry allows the resin to naturally flow and create reinforcing regions around the leads, achieving both structural strength and manufacturing efficiency in a single molding operation.
Solution Approach 2:
The package employs a composite structure combining the lead material with the resin molded body, creating first, second, and third resin regions that work together with the lead portions. This composite approach provides enhanced mechanical strength and light extraction efficiency while maintaining manufacturing feasibility through integrated molding.
Data Source
AI summary
A light emitting device includes a resin molded body, which includes a front surface having an opening, a bottom surface opposite to the opening a front-rear direction of the light emitting device, and first and second wall portions extending from the bottom surface to the front surface. A first lead includes a first bottom portion provided on the bottom surface, first and second side portions provided in the first and second wall portions, respectively. A second lead include a second bottom portion provided on the bottom surface apart from the first lead to provide a first resin region, third and fourth side portions provided in the first and second wall portions apart from the first lead to provide second and third resin regions, respectively. The first resin region is provided between the second resin region and the third resin region viewed in the front-rear direction.