LED Encapsulating Resin with Light Reflection Component
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Solution Overview
Problem
Conventional light-emitting diode (LED) devices with flip chip mounting face complexity and increased production costs due to the need for a separate diffusion film to enhance light-extraction efficiency.
Innovation Solution
Incorporating a light reflection component into the encapsulating resin layer of the LED element, which reflects light emitted from the optical semiconductor layer, eliminating the need for a separate diffusion film and simplifying the device structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a diffusion film is provided separately from the optical semiconductor layer or encapsulating resin layer to improve light extraction efficiency, then light extraction efficiency is improved, but device structure becomes complicated and production costs increase
Solution Approach 1:
The patent combines the light reflection function with the encapsulating resin layer by incorporating a light reflection component (such as white pigment or reflective particles) into the resin material. This merging eliminates the need for a separate diffusion film while maintaining light extraction efficiency, thereby simplifying the device structure and reducing production costs
Solution Approach 2:
The encapsulating resin layer is formulated as a composite material containing both the resin matrix and light reflection components (such as titanium oxide, zinc oxide, or other reflective particles). This composite structure provides both encapsulation and light reflection functions simultaneously, resolving the contradiction between improving light extraction efficiency and maintaining simple device structure
2Reliability
If a diffusion film is provided separately to enhance light extraction efficiency, then light extraction efficiency is improved, but production costs increase
Solution Approach 1:
The patent merges the light reflection function into the encapsulating resin layer, eliminating the need for a separate diffusion film component. This reduces the number of parts and assembly steps, thereby lowering production costs while maintaining improved light extraction efficiency
Solution Approach 2:
The encapsulating resin layer is designed to serve multiple functions: encapsulation protection, light reflection, and light extraction enhancement. By making the resin layer multi-functional, the patent eliminates the need for separate components, reducing both device complexity and production costs
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for improved light extraction efficiency while reducing production costs and maintaining a simple device structure, as demonstrated in the described LED device embodiments.
Implementation Method 1
the encapsulating resin layer containing a light reflection component... light emitted from the optical semiconductor layer receiving electric power from the electrode unit can be reflected at the encapsulating resin layer
Data Source
AI summary
A light-emitting diode element includes an optical semiconductor layer, an electrode unit to be connected to the optical semiconductor layer, and an encapsulating resin layer that encapsulates the optical semiconductor layer and the electrode unit, the encapsulating resin layer containing a light reflection component.