LED Reflective Layer Structure to Block Resin Light Shielding
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Solution Overview
Problem
The light conversion efficiency of optoelectronic semiconductor devices is reduced due to the resin of the reflective layer penetrating between the light-emitting chip and the light-permeable layer during the molding process, which shields the light emitted by the chip.
Innovation Solution
A light-emitting device structure featuring a light-emitting chip with a first reflective layer surrounding its side surface, an adhesive element with a central portion and extension portions connecting to the reflective layer, and a second reflective layer covering the extension portions, preventing resin penetration and enhancing light emission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If a reflective layer is formed during the molding process, then the light emission is enhanced, but the resin penetrates between the light-emitting chip and light-permeable layer, reducing light conversion efficiency
Solution Approach 1:
The adhesive layer is segmented into a body portion and extension portions, where the extension portions specifically target and seal the gap between the light-emitting chip and light-permeable layer, preventing resin penetration while maintaining overall adhesive function
Solution Approach 2:
The extension portions of the adhesive layer act as an intermediary barrier that fills and seals the gap between components, preventing the reflective layer resin from penetrating into the light emission path while allowing light to pass through the light-permeable layer
2Loss of energy
If the adhesive layer is increased in thickness to prevent resin penetration, then light conversion efficiency is improved, but the structural complexity and manufacturing difficulty increase
Solution Approach 1:
The adhesive layer is divided into a body portion and extension portions with different functions, where extension portions specifically address resin penetration prevention while the body portion provides general adhesion, allowing thin overall design with targeted reinforcement
Solution Approach 2:
The adhesive layer extends in the horizontal dimension through extension portions rather than increasing vertical thickness, sealing gaps laterally between components without adding significant height to the device structure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This structure improves the luminous effect and photoelectric conversion efficiency by ensuring the light-emitting surface is exposed and flush with the second reflective layer, increasing luminance by about 18% compared to prior art.
Implementation Method 1
The first reflective layer surrounds a first side surface of the light-emitting chip... The second reflective layer surrounds the second side surface and covers the at least one extension portion
Implementation Method 2
The adhesive element disposed between the light-emitting chip and the light-permeable layer
Implementation Method 3
The light-permeable layer is disposed on the light-emitting surface of the light-emitting chip, and the light-permeable layer has a light-exiting surface
Data Source
AI summary
A light-emitting device and a manufacturing method thereof are provided. The light-emitting device includes a light-emitting chip, a first reflective layer, a light-permeable layer, an adhesive material, and a second reflective layer. The light-emitting chip has a light-emitting surface. The first reflective layer surrounds a first side surface of the light-emitting chip. The light-permeable layer is disposed on the light-emitting surface of the light-emitting chip and has a light-exiting surface and a second side surface. The adhesive material has a central portion and an extension portion. The central portion corresponds to the light-emitting surface. The extension portion is connected to the central portion and is located on a first upper surface of the first reflective layer. The second reflective layer is disposed on the first reflective layer to surround the second side surface of the light-permeable layer and cover the extension portion.