LED Resin Layering With Trenches for Low-Cost Manufacturing
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Solution Overview
Problem
Existing methods for manufacturing light emitting devices, such as those using LED, are costly due to the increased number of steps required, particularly in applying uncured resin for wavelength conversion layers and mounting light transmissive plate-like members on each element.
Innovation Solution
A manufacturing method involving a mounting step, first resin formation, trench formation, and second resin charging, which collectively forms resin layers on a substrate with light emitting elements, reducing the number of steps and enabling low-cost production of high-luminance devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If uncured resin is applied to each light emitting element and light transmissive plate-like member is mounted on each element, then the wavelength conversion layer is formed properly, but the number of manufacturing steps increases and production cost increases
Solution Approach 1:
The patent merges the formation of wavelength conversion layers for multiple light emitting elements into a single simultaneous process. Instead of applying uncured resin and mounting plate-like members on each element separately, the invention applies a single layer of uncured resin containing wavelength conversion particles that covers multiple elements, then mounts a single light transmissive plate-like member that spans across all elements. This combining approach maintains proper wavelength conversion layer formation while dramatically reducing the number of manufacturing steps and improving production efficiency
2Manufacturing precision
If uncured resin is applied to each light emitting element and light transmissive plate-like member is mounted on each element, then the wavelength conversion layer is formed properly, but the manufacturing cost increases
Solution Approach 1:
The invention combines multiple discrete manufacturing operations into fewer integrated steps. By applying one layer of uncured resin containing wavelength conversion particles across multiple light emitting elements simultaneously, and mounting one light transmissive plate-like member across all elements, the process eliminates repeated application and curing cycles. This merging of operations maintains the necessary wavelength conversion layer formation quality while significantly reducing material waste, processing time, and overall manufacturing cost
3Reliability
If a light transmissive plate-like member is mounted on each light emitting element, then individual element coverage is ensured, but the number of steps increases making low-cost manufacture difficult
Solution Approach 1:
The patent employs a single light transmissive plate-like member that serves multiple functions simultaneously: it covers all light emitting elements, provides a uniform viewing surface across the entire device, and maintains structural integrity for the whole assembly. This universal component approach ensures that each element is properly covered while avoiding the complexity of mounting multiple individual plate-like members, thereby simplifying the manufacturing process and enabling low-cost production
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method allows for the efficient and cost-effective production of high-luminance light emitting devices with reduced steps, enabling mass production and flexibility in color variation and device size.
Implementation Method 1
a first resin formation step of forming a first resin layer by screen printing to directly cover the light emitting elements
Implementation Method 2
a second resin charging step of charging a second resin into the trench
Implementation Method 3
a first resin layer provided on the substrate to directly cover the light emitting element, and a second resin layer provided so as to surround side surfaces of the first resin layer
Data Source
Figure 1A~1B
Figure 1C~1D
Figure 1E~1F
AI summary
Provided is a method for manufacturing a light emitting device that can manufacture the light emitting device at low cost. The manufacturing method of a light emitting device includes: a mounting step of mounting a plurality of light emitting elements at predetermined intervals in one direction on a substrate; a first resin formation step of continuously forming a first resin layer in the one direction to directly cover the light emitting elements mounted; a trench formation step of forming a trench between the light emitting elements in a direction intersecting the one direction and a second resin charging step of charging a second resin into the trench. (Fig. 1A)