LED Arrays with Retention Material for Light Management
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Solution Overview
Problem
Current LED devices face challenges in providing improved light output performance and manufacturability for industrial and commercial lighting applications, particularly in replacing conventional light sources like HID and CFL lamps, while accommodating a range of low to high voltage applications.
Innovation Solution
The development of light emitting devices featuring group III-nitride based LEDs, which can be fabricated on silicon carbide substrates, coated with phosphors to produce white light, and arranged in specific patterns or arrays to enhance light emission and energy efficiency, including the use of retention materials and optimized substrate designs for improved light reflection and voltage handling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If conventional light sources (HID and CFL lamps) are used, then lighting performance is achieved, but energy consumption is high and environmental impact is negative
Solution Approach 1:
The patent changes the fundamental operating parameters by transitioning from thermal radiation (incandescent) and gas discharge (HID, CFL) to electroluminescence in LEDs. This parameter change enables significantly lower energy consumption while maintaining lighting performance, directly resolving the contradiction between energy efficiency and reliable illumination.
Solution Approach 2:
The invention employs composite material structures including phosphor-encapsulated LEDs, multi-layer semiconductor devices, and integrated optical systems. These composite structures enable efficient light conversion and distribution, achieving high lighting performance with reduced energy consumption compared to conventional single-material light sources.
2Power
If LED devices are designed for high voltage applications, then power output is increased, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent divides high-power LED systems into modular units with standardized interfaces. Each module contains integrated driver circuitry and optical components, allowing high total power output while maintaining simple individual module structures that are easier to manufacture and assemble.
Solution Approach 2:
The invention merges multiple functions into integrated LED modules, combining light emission, heat management, electrical driving, and optical control in single compact units. This integration achieves high power output without proportionally increasing device complexity, as shared components serve multiple purposes.
3Illumination intensity
If LED arrays are densely packed to increase light output, then illumination intensity is improved, but heat dissipation becomes more difficult
Solution Approach 1:
The patent transitions from planar LED arrangements to three-dimensional hierarchical structures with vertical stacking and multi-layer heat dissipation pathways. This dimensional change enables increased light output density while providing multiple thermal escape routes that prevent heat accumulation.
Solution Approach 2:
The invention introduces intermediary thermal management components including heat spreaders, thermal interface materials, and phased-change heat sinks positioned between LED arrays and heat sinks. These intermediaries facilitate efficient heat transfer from densely packed LEDs without requiring increased spacing that would reduce illumination intensity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
These devices offer enhanced light output performance, energy savings, and ease of manufacture, capable of delivering equal or greater illumination with reduced energy consumption, making them suitable for various lighting applications from low to high voltage scenarios.
Implementation Method 1
The phosphor coating can convert light emitted from one or more LED chips into white light. For example, LED chips can emit light having desired wavelengths, and phosphor can in turn emit yellow fluorescence with a peak wavelength of about 550 nm
Implementation Method 2
Light emitting devices, such as light emitting diodes (LEDs), may be utilized in packages for providing white light
Data Source
AI summary
Light emitting devices for light emitting diodes (LEDs) are disclosed. In one embodiment a light emitting device can include a substrate and a plurality of light emitting diodes (LEDs) disposed over the substrate in patterned arrays. The arrays can include one or more patterns of LEDs. A light emitting device can further include a retention material disposed about the array of LEDs. In one aspect, the retention material can be dispensed.