Reflective LED Carrier with Scattering Body for Omnidirectional Light
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Solution Overview
Problem
The production of LED filaments with silicone matrices is complex, costly, and requires a separate production line, differing significantly from other LED-based devices, and results in high material consumption and inefficient radiation distribution.
Innovation Solution
A device comprising a primary carrier with semiconductor chips and a radiation conversion material, where the primary carrier is reflective and the secondary carrier is transparent, combined with a scattering body to achieve omnidirectional radiation, allowing for efficient production and reduced material usage by applying radiation conversion material on one side and using a scattering body for deflection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If conventional LED filaments with silicone matrix are produced, then omnidirectional radiation is achieved, but production complexity increases and material consumption rises
Solution Approach 1:
The device segments the radiation conversion function by placing discrete radiation conversion elements on the carrier instead of using a continuous silicone matrix. This allows separate production of the carrier structure and radiation conversion elements, simplifying manufacturing while achieving omnidirectional radiation through strategic positioning of multiple semiconductor chips and their associated conversion elements
Solution Approach 2:
The invention extracts the radiation conversion material from the bulk silicone matrix used in conventional LED filaments and replaces it with discrete radiation conversion elements positioned on a different carrier structure. This extraction eliminates the need for complex silicone coating processes while maintaining the radiation conversion function
2Illumination intensity
If conventional LED filaments with silicone matrix are produced, then omnidirectional radiation is achieved, but material consumption increases
Solution Approach 1:
The invention extracts the radiation conversion material from the bulk silicone matrix and replaces it with thin-film or discrete radiation conversion elements. This dramatically reduces the volume of conversion material required while maintaining effective radiation conversion, as the material is applied only where needed rather than throughout a thick silicone encapsulant
Solution Approach 2:
The radiation conversion elements are positioned locally at specific positions on the carrier structure, concentrating the conversion material only where radiation conversion is needed. This local application reduces overall material consumption compared to the uniform silicone matrix that requires material throughout the entire filament volume
3Ease of manufacture
If radiation conversion material is applied on one side only, then production is simplified, but radiation conversion efficiency may be reduced
Solution Approach 1:
The carrier structure is segmented into multiple positions with semiconductor chips arranged at different locations. By strategically positioning chips and radiation conversion elements at specific positions on the single-sided carrier, the design achieves effective omnidirectional radiation without requiring dual-sided conversion material application, maintaining both manufacturing simplicity and conversion efficiency
Solution Approach 2:
The invention transitions from a conventional two-sided radiation conversion approach to a single-sided approach by utilizing the spatial arrangement of multiple semiconductor chips and radiation conversion elements on the carrier surface. This dimensional reorganization allows radiation to be emitted and converted in multiple directions from a single face, achieving omnidirectional radiation without dual-sided material application
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies and cost-reduces the production of LED filaments, achieving omnidirectional radiation with a filigree appearance and improved mechanical stability, while minimizing radiation conversion material volume and enhancing light distribution.
Implementation Method 1
The radiation conversion material is formed to convert at least a part of the primary radiation generated by the semiconductor chips in operation into secondary radiation
Implementation Method 2
The primary carrier is formed reflective to the primary radiation at least in the region of the semiconductor chips
Implementation Method 3
a scattering body is arranged on a front side of the secondary carrier facing the primary carrier, the scattering body covering the semiconductor chips
Data Source
AI summary
A device with semiconductor chips on a primary carrier is disclosed. In an embodiment a device includes a primary carrier, a plurality of semiconductor chips arranged on the primary carrier, a radiation conversion material arranged at least in places on the semiconductor chips and the primary carrier, a secondary carrier to which the primary carrier is attached and a scattering body arranged on a front side of the secondary carrier facing the primary carrier, the scattering body covering the semiconductor chips, wherein the primary carrier is formed reflective to primary radiation at least in a region of the semiconductor chips, and wherein, during operation of the device, at least secondary radiation exits through a front side of the scattering body facing away from the secondary carrier and through a rear side of the secondary carrier facing away from the primary carrier.