LED Display Screen Pad Layout for Higher Pixel Density
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Solution Overview
Problem
Existing LED display technologies face challenges in achieving high resolution due to the large spacing between LED lamp beads on the circuit board, which results in low dot density and bonding difficulties, leading to low yield rates.
Innovation Solution
The implementation of a display screen structure with a smaller, easier-to-form positive electrode pad, which reduces the overall size of the structure formed by the pad and the LED chips, thereby increasing dot density and improving bonding stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the distance between adjacent LED lamp beads is reduced to increase resolution, then the dot density per unit area increases, but the bonding difficulty increases and yield rate decreases
Solution Approach 1:
The positive electrode pad structure is segmented into multiple negative electrode pads arranged in specific patterns (first, second, third, and fourth negative electrode pads). This segmentation allows for optimized electrical connections and reduced bonding complexity, enabling higher resolution displays while maintaining reliable bonding through distributed connection points rather than large single pads
Solution Approach 2:
The patent transitions from a conventional single large positive electrode pad to a multi-pad arrangement in different spatial dimensions. The negative electrode pads are positioned at different locations relative to the LED lamp bead, creating a distributed connection architecture that reduces the required pad size while maintaining electrical reliability through multiple connection paths
2Manufacturing precision
If the positive electrode pad size is reduced to increase dot density, then the resolution improves, but the bonding stability deteriorates
Solution Approach 1:
The large positive electrode pad is divided into multiple smaller negative electrode pads (first, second, third, fourth negative electrode pads) positioned at different locations. This segmentation enables the use of smaller pad structures that increase dot density while maintaining bonding stability through distributed connection points that collectively provide sufficient bonding area and mechanical strength
Solution Approach 2:
The patent changes the geometric parameters of the electrode pad structure from a single large pad to multiple smaller pads with specific area ratios and positional relationships. The first negative electrode pad has a larger area than the second, third, and fourth pads, and the pads are positioned at specific distances from the LED lamp bead, optimizing both dot density and bonding stability through parameter optimization
Data Source
AI summary
A display screen allowing higher pixel density and thus better screen resolution by virtue of the structures connecting to LED chip light sources includes a substrate, a number of pad structures, the LED chips, and a number of carrier boards. Each pad structure includes a positive electrode pad and three negative electrode pads. Each LED chip package includes a red light chip, a green light chip, and a blue light chip arranged on the three negative electrode pads. Each carrier board includes a positive electrode connection terminal and a negative electrode connection terminal, the positive electrode connection terminal is electrically connected to the positive electrode pad, the negative electrode connection terminal is electrically connected to one red light chip, one green light chip, or one blue light chip. The disclosure also provides a displaying device having the display screen.