LED Sealing Member Thickness Control via Brightness Correlation
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Solution Overview
Problem
Conventional methods for reducing the thickness of a sealing resin to achieve desired brightness in LED light emission are inaccurate due to variations in substrate thickness, making it difficult to achieve precise thickness reduction.
Innovation Solution
A tool cutting method involving a correlation table to measure LED chip brightness, calculate the required sealing member thickness, and precisely cut the sealing member using a tool cutting unit to achieve the desired brightness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the thickness of the workpiece is measured and the sealing resin is cut according to the design thickness of the substrate, then the sealing resin thickness can be reduced, but the actual thickness varies largely from the design thickness making it difficult to achieve high accuracy
Solution Approach 1:
The patent changes the measurement parameter from substrate thickness to sealing resin thickness directly. By measuring the thickness of the sealing resin itself rather than inferring it from substrate design thickness, the method directly obtains accurate thickness data that reflects actual variations, enabling precise cutting to achieve the target brightness.
2Adaptability or versatility
If the substrate thickness varies largely from design thickness, then manufacturing flexibility is improved, but the cutting accuracy of sealing resin deteriorates
Solution Approach 1:
The patent implements a feedback mechanism where the measured sealing resin thickness is used to determine the cutting amount. The measurement result feeds back to the cutting process, allowing the system to automatically adjust for substrate thickness variations and achieve consistent sealing resin thickness regardless of substrate variations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method allows for accurate reduction of the sealing member thickness to achieve the desired brightness of LED chip emission, ensuring consistent light output.
Implementation Method 1
a plurality of LED chips mounted on the substrate, and a sealing member including a fluorescent material for covering the LED chips
Implementation Method 2
measuring the thickness of the sealing member to a finished thickness corresponding to a desired brightness of light emitted from the LED chips
Implementation Method 3
a sealing member including a fluorescent material for covering the LED chips
Data Source
AI summary
A tool cutting method which includes a correlation table preparing step of preparing a correlation table indicating the correlation between the brightness of light emitted from LED chips and the thickness of a sealing member, a brightness measuring step of measuring the brightness of light emitted from the LED chips by applying a voltage to the LED chips, a calculating step of calculating the thickness of the sealing member corresponding to the desired thickness from the brightness measured in the brightness measuring step and the correlation table, and a cutting step of cutting the sealing member by using a tool cutting unit after performing the calculating step to reduce the thickness of the sealing member to a finished thickness providing the desired brightness of light emitted from the LED chips.