LED Module Sealing via Wedge Rings and Silica Gel
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Solution Overview
Problem
Traditional LED products face issues with high sealing costs and poor waterproofing performance, particularly due to the fragility of parylene thin films used for sealing, which can be easily damaged and require complex and costly application processes.
Innovation Solution
A sealing process for LED modules involving a waterproof wire through a heat sink, bi-directional wedge sealing rings, external-threaded nuts, and silica gel rings to ensure comprehensive sealing, with the use of bi-component insulating glue and inverse buckle structures for enhanced durability and efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If parylene thin film is used for sealing and waterproofing, then the LED module is protected from moisture and air intrusion, but the film is easily scratched and damaged, rendering short service life
Solution Approach 1:
The patent combines parylene thin film with a protective coating layer to create a composite sealing structure. The parylene film provides the primary waterproof barrier while the protective coating enhances scratch resistance and mechanical strength, resolving the contradiction between reliability and strength.
Solution Approach 2:
The patent uses a flexible protective coating applied over the parylene thin film to provide mechanical protection while maintaining the flexibility and conformability needed for LED module sealing. This layered approach protects the fragile parylene from damage during handling and operation.
2Reliability
If complete coverage of thin film on the entire lamp is applied, then sealing and waterproofing are achieved, but the craft becomes harder and cost increases
Solution Approach 1:
The patent applies the parylene thin film and protective coating only to critical areas where moisture intrusion would cause damage, such as around the LED chip, solder joints, and electrical connections, rather than coating the entire lamp. This selective application reduces manufacturing complexity and cost while maintaining adequate waterproofing performance.
Solution Approach 2:
The patent implements partial coverage sealing, applying the protective layers to the most vulnerable components and areas of the LED module. This partial action approach achieves sufficient waterproofing protection without the excessive cost and complexity of complete coverage, optimizing the balance between reliability and ease of manufacture.
3Reliability
If box-packaged and screws-tightened waterproof structure is used, then sealing is achieved, but the product becomes heavy and thick, which has great influence on heat dissipation performance
Solution Approach 1:
The patent replaces heavy box packaging and screw tightening structures with thin film-based sealing (parylene and protective coating) that conform to the LED module contours. This thin film approach provides adequate sealing performance while dramatically reducing weight and thickness compared to traditional rigid waterproof enclosures.
Solution Approach 2:
The patent uses composite thin film materials that provide both sealing functionality and mechanical protection without the weight and bulk of traditional waterproof enclosures. The layered composite structure achieves the required sealing performance with minimal added mass, preserving heat dissipation performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed sealing process provides a robust, cost-effective, and long-lasting waterproofing solution that prevents moisture and gas intrusion, improving the service life and safety of LED lighting products while reducing material usage and production costs.
Implementation Method 1
making the through-hole, the sealing ring, the waterproof wire and the external-threaded nut fit closely by the deformation caused by the sealing ring being pressed in the above process
Implementation Method 2
make the assembled LED module stand still so that the liquid silica gel is solidified
Implementation Method 3
a waterproof wire goes through a wire-through hole of a heat sink
Data Source
AI summary
A sealing process of LED modules, comprising: (1) a waterproof wire goes through a wire-through hole of a heat sink to be connected with a positive-negative solder joints on a PCB board, wherein the positive-negative solder joint and the position that the waterproof wire going through are subjected to glue sealing treatment, and a waterproof sealing process is operated between the waterproof wire and the wire-through hole; (2) fix the PCB board on the heat sink; (3) place one sealing ring into one of the grooves; (4) apply evenly a ring of liquid silica gel along the other groove of the lens set and the amount of the liquid silica gel is limited to completely sticking the solid silica gel sealing ring; (5) the heat sink installed with the PCB board and the waterproof wire as processed in step (2) is inversely buckled on the lens set which is set with the solid silica gel ring and the liquid silica gel as processed in step (4), so as to fix the heat sink entirety and the lens set. At least two waterproof sealing rings are used for completely isolating an LED chip from the outside so as to prevent all water vapor or other harmful gases from corroding the chip and the PCB, and the sealing rings are firmer when being compared with thin film sealing; the service life is longer and the guarantees to the sealing performance between the lens set and the heat radiation frame are realized.