LED Lamp Sector Boards for Heat Dissipation

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Solution Overview

Problem

LED lighting systems face challenges in achieving efficient heat dissipation and light distribution without the need for separate heat sinks, while maintaining a compact form factor and omnidirectional light emission.

Innovation Solution

The use of thermally conductive LED boards, such as FR4 or metal core printed circuit boards, within an optically transmissive enclosure that divides the interior space into sectors, allowing for both heat dissipation and light reflection to create a uniform light pattern without a traditional heat sink.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a separate heat sink is used to cool LEDs, then heat dissipation is improved, but device complexity and volume increase

Engineering Contradiction:
Improveheat dissipationVSAvoidstructure complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The patent combines the LED mounting board with heat dissipation functionality by using a thermally conductive substrate that serves both as an electrical circuit carrier and a heat sink. The board integrates electrical traces for current delivery and thermal pathways for heat removal, eliminating the need for separate heat sink components and reducing overall device complexity.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The LED mounting board is designed to perform multiple functions simultaneously: it provides electrical connection through printed circuit traces, mechanical support for LED packages, optical reflection to enhance light output, and thermal management through its thermally conductive substrate. This multi-functional design replaces what would traditionally require multiple separate components.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Illumination intensity

If an optically transmissive enclosure is used, then light distribution is improved, but heat dissipation becomes more difficult

Engineering Contradiction:
Improvelight distributionVSAvoidheat dissipation
Core Design Contradiction:
Illumination intensityVSTemperature

Solution Approach 1:

The enclosure is designed with different optical properties in different regions: certain areas are made optically transmissive to allow light passage, while other areas incorporate reflective surfaces to redirect light and enhance distribution. The thermal management system is localized to the mounting board area where heat generation occurs, allowing efficient heat dissipation without compromising the optical performance of the enclosure.

Inventive Principle:
Principle #3Local quality

3Illumination intensity

If LED boards with reflective surfaces are used, then light output is improved, but manufacturing complexity increases

Engineering Contradiction:
Improvelight outputVSAvoidmanufacturing complexity
Core Design Contradiction:
Illumination intensityVSEase of manufacture

Solution Approach 1:

The LED mounting board uses a composite structure combining a thermally conductive substrate with a reflective surface layer. This composite material approach allows the board to provide both thermal management and optical enhancement functions in a single manufacturable component, avoiding the need for separate reflective shields or complex multi-step assembly processes.

Inventive Principle:
Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enables effective heat dissipation and omnidirectional light emission, enhancing the performance and efficiency of LED lamps by integrating thermal management into the LED boards while maintaining a compact design.

Implementation Method 1

The at least one LED board may dissipate heat from the at least one LED without a heat sink. The at least one LED board may comprise a large area of thermally conductive material.

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

A portion of the at least one LED board may comprise a reflective surface. The reflective surface may create a reflected light source from the at least one LED.

Methodology Applied
Scientific EffectLight reflection: Reflection

Implementation Method 3

At least one LED is located in each of the at least two sectors in the enclosure and is operable to emit light when energized through an electrical path from the base.

Methodology Applied
Scientific EffectLight emitting diode effect: Light Emitting Diode

Data Source

PatentUS9562677B2LED lamp having at least two sectors
Publication Date: 2017.02.07 PROSPERINA VENTURES LLC
  • US9562677B2 patent drawing
  • US9562677B2 patent drawing
  • US9562677B2 patent drawing

AI summary

A lamp comprises an interior space and a base. An enclosure may be connected to the base to enclose the interior space. At least one LED board divides the interior space into a plurality of sectors. An LED is located in each sector in the enclosure operable to emit light when energized through an electrical path from the base. Light from the LED is reflected by a wall of the sector to create a reflected light source.