LED Package with Segmented Cavity for High Luminance
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Solution Overview
Problem
The existing LED packages face limitations in reducing the size of cavities, which hinders the minimization of the light source area, thereby affecting luminance, as larger cavities result in increased real light source size and reduced luminance.
Innovation Solution
The proposed solution involves a light emitting diode package design with a package mold featuring a first cavity and one or multiple second cavities of smaller size, both with the same depth, where the second cavity is thinner and in contact or spaced from the first cavity, and a groove for communication between them, allowing for a minimized light source size through optimized electrode pads and wire placement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If the cavity size is reduced to minimize the light source area, then the luminance is improved, but the space for mounting the LED chip and wires becomes insufficient
Solution Approach 1:
The cavity is divided into a first cavity for mounting the LED chip and a second cavity for mounting the electrode pad, allowing each cavity to be optimized independently for its specific function while collectively minimizing the overall light source area
Solution Approach 2:
The patent utilizes three-dimensional space optimization by configuring the first and second cavities at different depths and positions within the package mold, effectively utilizing vertical and horizontal dimensions to minimize the projected light source area while providing sufficient volume for all components
2Area of stationary object
If the cavity size is reduced, then the light source area is minimized, but the wire bonding space and electrode pad placement become constrained
Solution Approach 1:
The electrode pad is extracted and mounted on a separate second cavity distinct from the LED chip mounting area, creating dedicated spaces that simplify wire routing and bonding operations while maintaining minimal overall light source area
Solution Approach 2:
The second cavity acts as an intermediary structure that provides a dedicated mounting location for the electrode pad, facilitating wire bonding by separating the electrical connection function from the LED chip mounting function while maintaining compact dimensions
Data Source
AI summary
The present invention provides a light emitting diode package including: a package mold having a first cavity and a second cavity with a smaller size than that of the first cavity; first and second electrode pads provided on the bottom surfaces of the first cavity and the second cavity, respectively; an LED chip mounted on the first electrode pad; a wire for providing electrical connection between the LED chip and the second electrode pad; and a molding material filled within the first cavity and the second cavity.